半导体产业具有典型的“金字塔”结构。上游环节越多，企业数量越少，产值越大，技术难度也越高。由于起步较晚、缺乏核心技术、人才短缺，我国半导体发展受到极大制约。由于未能掌握核心技术，常常被其他国家阻碍。目前，关键芯片领域仍然依赖进口。
The ZTE incident in 2018 is still fresh in our minds! Not long ago, the United States relied on the core semiconductor technology and equipment it mastered to upgrade its sanctions on Huawei in an attempt to restrict Huawei and my country's development in the high-tech field!
美国举起“技术”长矛，刺穿了我国“核心技术短缺”的弱点。这在给我国半导体产业敲响警钟的同时，也让许多人和许多公司意识到，依赖美国技术是不可靠的。只有掌握核心技术，摆脱技术依赖，才是正确的道路！
目前，我国已将半导体产业发展提升到战略高度，将半导体产业列为国家重点发展产业，投入大量资金和人才以期取得技术突破，力争早日走上自主研发、自给自足的道路。当前亟待突破的核心技术领域包括以下几个方面。
作为集成电路产业的核心设备，光刻机被誉为“人类最精密复杂的机器”。目前，全球唯一一家能够生产高端光刻机的公司是荷兰的ASML，而日本的尼康和佳能则生产中低端光刻机，它们的市场份额超过80%。
光刻系统是芯片制造的核心。光刻是半导体芯片生产过程中最复杂、最关键的工艺步骤，耗时耗力。半导体芯片生产的难点和关键在于将电路图从掩模转移到硅片上，而这一过程正是通过光刻实现的。光刻工艺的水平直接决定了芯片的工艺水平和性能水平。
高端光刻机堪称现代光学产业的瑰宝，制造难度极高。目前，ASML最先进的EUV极紫外光刻机能够生产5nm工艺的芯片，单台价格已超过100亿美元。而中国自主研发的光刻机目前只能达到90nm工艺，差距巨大。
What is the difficulty in developing a photolithography machine? Lithography machines involve many advanced technologies such as system integration, precision optics, precision motion, precision material transmission, and high-precision micro-environment control. They are the most technologically advanced equipment among all semiconductor manufacturing equipment. In order for ASML to obtain the world's most advanced technology in different parts of the entire equipment, more than 90% of the parts in ASML's lithography machines are purchased from outside. ASML brings together the world's most cutting-edge technologies in technology research and development, such as German mechanical technology, Germany's top Zeiss lenses, American light sources and measurement equipment, etc. It can be said that ASML's high-end lithography machines are "the product of human wisdom."
Chinese manufacturer:SMEE上海微电子
CPU is a very large-scale integrated circuit, which is the computing core and control core of a computer. Its function is mainly to interpret computer instructions and process data in computer software. The central processing unit mainly includes arithmetic units (arithmetic and logical operation units) and cache memories, as well as the data, control and status buses that implement the connections between them. Together with internal memory and input/output devices, it is the three core components of an electronic computer. The CPU relies on instructions from the computing and control system. Each CPU is designed with a series of instruction systems that match its hardware circuits. The strength of instructions is also an important indicator of the CPU. The instruction set is one of the most effective tools to improve the efficiency of microprocessors.
Intel and AMD in the United States occupy almost all of the global PC market. The application fields of domestic CPUs cover not only professional fields such as embedded devices and server equipment, but also the consumer-level civilian market. Due to the huge differences in service targets and application fields, different types of domestic CPUs have different perceptions in the hearts of Chinese people. For example, Feiteng and Shenwei, which are specifically targeted at servers, are not well-known.
CPU发展日新月异，主频、运算能力和功耗是衡量其性能的重要指标。作为后起之秀，中国的研发水平始终与世界先进水平存在较大差距。例如，龙神CPU的性能似乎总是落后于英特尔。龙神CPU是由中国科学院计算技术研究所自主研发的通用CPU，采用与MIPS指令集类似的RISC指令集。然而，龙神CPU的成功研发助力复兴高铁实现了100%国产化，使得第四代歼-20相控阵雷达和北斗卫星得以搭载国产CPU核心。
在移动CPU领域，高通的地位依然稳固。华为海思的麒麟CPU性能也相当不错，尽管它背后是英国巨头ARM的强大支持。紫光展锐在移动CPU芯片领域也取得了一些成就。但令人担忧的是，美国近期加大了对华为的制裁力度，试图限制华为在半导体芯片领域的发展。麒麟CPU的未来仍然充满未知。
Chinese manufacturer:Huawei HiSilicon, Unisoc, Loongson Zhongke (Loongson CPU), Tianjin Feiteng (Feiteng CPU), Shanghai Zhaoxin (Zhaoxin CPU), etc.
目前全球有三大集成电路EDA软件公司，分别是Mentor Graphics、Cadence和Synopsys。这三家美国公司在EDA行业的市场份额几乎已形成垄断。目前，能够覆盖芯片设计和生产全流程的EDA供应商只有Cadence和Synopsys。
Major chip production and design manufacturers such as Intel, Apple and Qualcomm all need to purchase EDA software and related services from these two companies. China's top chip design companies Huawei HiSilicon, Yangtze Memory, and UNISOC all purchase EDA design software from these American companies.
Domestic EDA manufacturers BGI Jiutian, Xinhe Technology, Guangli Microelectronics, etc. can only provide some EDA design tools and cannot provide EDA tools covering the entire industry chain such as IC design, wiring, verification and simulation. Moreover, the combination of domestic EDA software and advanced technology is not good, and there is insufficient support for chips with advanced technology. Therefore, the technical capabilities of domestic EDA companies are far from being able to compete with these top international EDA companies.
国际顶级制造商：Mentor Graphics (USA), Cadence (USA), Synopsys (USA)
Chinese manufacturer:BGI Jiutian, Xinhe Technology, Guangli Micro, etc.
DRAM是动态随机存取存储器，是目前最常用的系统内存。美国的Micron、韩国的Samsung和SK Hynix占据绝对垄断地位，主导着DRAM市场。
中国三大存储芯片企业——长江存储、合肥长信、兆芯——已开始布局并投入存储芯片的生产，有望打破韩国、美国和日本对存储芯片的垄断。
长江存储今年实现了基于Xtacking架构的64层3D NAND闪存的量产。随后，他们直接跳过了业内常见的96层，成功研发出128层3D NAND闪存。
Hefei Changxin achieved mass production of 8G DDR4 memory using the 19nm process in 2019, and will officially commercialize the independently developed Guangweiyi PRO DDR4 memory this year and introduce it to the consumer market.
GigaDevice ranks first in the domestic market share of NOR flash and is also one of the top three suppliers of NOR flash in the world. It is currently gradually expanding into NAND flash and actively deploying DRAM business.
DRAM is the most likely to be mass-produced locally among the core semiconductor technologies that need to be broken through, and it is worth looking forward to.
国际顶级制造商：Micron (USA), Samsung (South Korea), SK Hynix (South Korea), etc.
Chinese manufacturer:Yangtze River Storage, Hefei Changxin, GigaDevice
A radio frequency chip refers to an electronic component that converts radio signal communication into a certain radio signal waveform and sends it out through antenna resonance. The radio frequency chip architecture includes two parts: the receiving channel and the transmitting channel. For the existing GSM and TD-SCDMA modes, if the terminal supports an additional frequency band, its radio frequency chip will add a receiving channel accordingly, but whether a new transmitting channel is needed depends on the relationship between the new frequency band and the original frequency band.
中国是全球最大的手机生产国，但却无法生产高端手机射频器件。这需要扎实的材料、工艺和设计经验积累。国内有很多企业从事低端和中端射频芯片的生产，也占据了相当大的市场份额。然而，在高端射频芯片领域，仍有很大的增长空间。
国际顶级制造商：Skyworks（美国）、Qorvo Verizon（美国）等。
Chinese manufacturer:紫光展锐、伟杰创新、中普微等
CPLD is a device developed from PAL and GAL devices. It is relatively large in scale and complex in structure, and belongs to the scope of large-scale integrated circuits. It is a digital integrated circuit that allows users to construct logical functions according to their own needs. The basic design method is to use an integrated development software platform to generate corresponding target files using schematic diagrams, hardware description languages and other methods, and then transfer the code to the target chip through a download cable ("in-system" programming) to realize the designed digital system.
FPGA（现场可编程门阵列）是基于PAL、GAL和CPLD等可编程器件的进一步发展产品。它作为一种半定制电路出现在专用集成电路（ASIC）领域，不仅解决了定制电路的缺点，还克服了原始可编程器件门数有限的缺点。
FPGA行业的准入门槛很高。过去十年左右，包括英特尔、IBM、摩托罗拉、飞利浦、东芝和三星在内的60多家公司都曾试图涉足这一领域。除了英特尔以16.7亿美元收购Altera成功进入该领域外，其他公司均以失败告终。目前FPGA市场巨头均位于美国，例如赛灵思（Xilinx）、Altera、莱迪思（Lattice）、Actel、Atmel、Avago、赛普拉斯（Cypress）等，每家公司都有其独特的“秘密武器”。其中，赛灵思是全球FPGA领域的领导者，在门数千万级和16纳米制程方面均处于领先地位；Actel是反熔丝技术的先驱和航空航天级产品的先驱。其他公司的产品则是工业级、军用级和航空航天级产品不可或缺的核心芯片。它们也是全球从事尖端技术研发的国家所面临的不足和主要痛点。其中，赛灵思和阿尔特拉两家公司占据了90%的市场份额。国内厂商与国外厂商在技术水平上存在巨大差距。尽管国内有数百家FPGA厂商参与竞争，但它们基本上分布在中低端市场。大多数FPGA的门级约为10万。虽然也有少数自主研发的20万门级FPGA，但中国电子科技集团的35万门级FPGA和中国电子科技集团的70万门级FPGA是一项重大的技术突破。
同创持续引领中国FPGA产业发展。继实现国内首款千万门FPGA产品量产出货后，同创加快研发步伐，陆续补充和完善了所有3000万门以下的中低端产品型号。其中，Logos和Compact系列产品已实现量产。Logos2和Titan2系列产品将于今年全面量产，能够满足国内所有中低端应用的需求，市场份额约占60%，基本能够满足中国电子信息产业的稳定发展需求。
国外主要制造商：Xilinx（美国）、Altera（美国）等。
Chinese manufacturer:深圳紫光展锐、上海复旦微电子、北京微电子等。
DSP chip refers to a chip that can implement digital signal processing technology. The interior of the DSP chip uses a Harvard structure that separates program and data. It has a dedicated hardware multiplier, widely uses pipeline operations, and provides special DSP instructions that can be used to quickly implement various digital signal processing algorithms.
DSP chips have developed rapidly since their birth. On the one hand, they benefit from the development of integrated circuits, and on the other hand, they also benefit from the huge market. In just two decades, DSP chips have been widely used in signal processing, communications, radar, imaging, military, instrumentation, automation and many other fields.
目前，全球DSP芯片市场仍被几家巨头企业垄断。德州仪器、ADI、飞思卡尔、摩托罗拉等都是该行业的领军企业。国产DSP芯片起步较晚。2006年，中国电力科学研究院第十四研究院与龙芯电子股份有限公司合作研发国产DSP芯片。他们于2012年研发的“华锐一号”性能优于飞思卡尔的MPC8640D。2017年，国产DSP芯片“华锐二号”上市。
国外主要制造商：TI（德州仪器，美国）、ADI（亚德诺半导体，美国）等。
Chinese manufacturer:中电14、中电38、湖南金鑫电子、北京中兴微电子等
显示核心，又称视觉处理器、显示芯片，是一种专门用于个人电脑、工作站、游戏机以及部分移动设备（如平板电脑、智能手机等）图像计算的微处理器。其作用是转换并驱动计算机系统所需的显示信息，向显示器提供扫描信号，并控制显示器的正确显示。它是连接显示器和个人电脑主板的重要组件，也是实现“人机对话”的重要设备之一。
提到GPU，人们首先想到的就是NVIDIA，它占据了全球GPU市场一半以上的份额，AMD的GPU也占有一席之地。国内GPU企业尚未形成大规模生产，相关技术也正在积极研发中。目前，国内从事GPU研发的企业包括上海兆芯、华为、Vivante、天书智信、华夏芯片、CoreView、中国船舶重工集团公司709研究所、中航工业集团公司631研究所等。据OFweek电子工程网编辑介绍，中国船舶重工集团公司自主研发的凌久GP101芯片，填补了国内显卡领域的空白。凌久GP101是一款高性能、低功耗的图形处理芯片，但与欧美等先进厂商相比，仍有很长的路要走，距离世界领先水平还有很长的路要走。
国外主要制造商：Imagination（英国）、高通（美国）、英伟达（美国）、AMD（美国）等。
Chinese manufacturer:景嘉围、上海兆信
MPU 也被称为微处理器或内存保护单元。MPU 是单个芯片，而芯片组则由一组芯片组成。早期芯片组甚至包含多达 7 或 8 个芯片，但现在大多数芯片都集成在两个芯片中，通常称为北桥芯片和南桥芯片。MPU 是计算机的计算、判断或控制中心，有些人称之为“计算机的心脏”。
Suppliers such as Intel, Qualcomm, Samsung, Freescale, MediaTek and Spreadtrum are leaders in this market. Domestic MPU market share is very small, almost zero, and companies such as BGI, Huawei, and Unisoc are increasing research and development of related technologies.
国外主要制造商：Intel (UK), Qualcomm (US), Freescale (US), etc.
Chinese manufacturer:紫光展锐、联发科
Semiconductor raw materials
Semiconductor manufacturing materials mainly include silicon wafers, electron gases, photomasks, photoresist supporting chemicals, polishing materials, photoresists, wet chemicals and sputtering targets.
全球半导体材料产业仍由日本、美国、韩国、德国等国家绝对主导。中国半导体材料在靶材、封装基板、抛光液、光刻胶等产品细分领域取得了重大突破，部分产品的技术标准已达到世界一流水平，但整体水平与国际一流水平仍有较大差距。
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