Slkor MB10F Bridge Rectifier: 1000V Withstand Voltage 0.8A MB‑F Surface‑Mount Bridge Rectifier

MB10F is a surface-mount glass-passivated bridge rectifier belonging to MB05F-MB10F series, housed in MB-F molded plastic package for surface-mount technology. It features low forward voltage drop and high surge-current capability to realize AC-to-DC conversion. Electrical parameters are tested under ambient temperature of 25℃. Current derating is required for capacitive-load applications. It is widely adopted in medium-and-low-power power-supply rectification scenarios.

1. Core Product Parameters

Mechanical Parameters

1. Package type: MB-F molded plastic package
2. Terminals: Solderable plated terminals complying with MIL-STD-202 Method 208
3. Approximate weight: 0.134 g
4. Mounting position: Mountable in any orientation
5. Marking: Part number printed on component body
6. Environmental version: RoHS-compliant lead-free variant available
7. Key dimensions (unit: mm):

• A: 4.50~4.95
• B: 3.60~4.10
• C: 0.15~0.35
• D: Max 0.20
• E: 6.40~7.00
• G: 0.50~1.10
• H: 1.30~1.70
• J: 1.20~1.60
• K: 2.30~2.70
• L: Max 1.80

Maximum Electrical Ratings (at ambient temperature 25℃)

1. Repetitive peak reverse voltage: 1000 V
2. Operation mode: Single-phase half-wave 60 Hz for resistive and inductive loads; 20 % current derating is mandatory for capacitive-load conditions
3. Rated average rectified output current: Maximum 0.8 A on aluminum-substrate PC board; maximum 0.5 A on glass-epoxy PC board
4. Flammability class: UL94V-0

2. Key Product Features

1. Glass-passivated die construction for enhanced reliability.
2. Low forward voltage drop to reduce conduction power loss.
3. High surge-current capability against short-term current surges.
4. MB-F package optimized for surface-mount assembly and SMT production.
5. Package plastic material meets UL94V-0 flammability requirement.
6. RoHS-compliant lead-free version available for green-electronics requirements.
7. Arbitrary mounting orientation brings fewer constraints for PCB layout.

3. Main Application Fields

1. Secondary rectification circuits for small-size switching power supplies and adapters.
2. AC-input rectification modules on household appliance control boards.
3. Rectification units for LED driving power supplies.
4. AC-to-DC rectification circuits on various consumer-electronic PCBs.
5. Rectification for low-power industrial signal power supplies.

4. Engineering Design Recommendations

1. Current derating: Reduce operating current by 20 % when the circuit works with capacitive loads.
2. PCB pad layout: Follow recommended pad area of 1.3 mm². Aluminum-substrate PC boards deliver better heat dissipation and support higher output current than glass-epoxy PC boards.
3. Ambient-temperature derating: Allowable output current decreases as ambient temperature rises. Sufficient current margin shall be reserved under high-temperature conditions.
4. Surge-current handling: Pay attention to inrush surge current at power-on. Check surge-current cycle ratings to avoid component damage caused by frequent current shocks.
5. Reverse-voltage margin: Actual working reverse voltage shall never exceed repetitive peak reverse voltage; adequate voltage safety margin shall be reserved.
6. High-frequency applications: The component owns junction capacitance. Evaluate its circuit influence for high-frequency operating conditions.
7. Soldering: Terminals satisfy specified solderability. Complete soldering according to standard SMT process specifications.

5. Product Summary

MB10F is an MB-F-packaged surface-mount bridge rectifier with 1000 V withstand voltage, suitable for automated SMT assembly. It provides good surge-current tolerance and low conduction loss. Its performance is significantly affected by PCB material, ambient temperature and load type. Current and temperature derating shall be implemented during hardware design. This device targets medium-and-low-power AC-rectification circuits and is widely used in consumer electronics, household appliances and miniature power supplies. Its lead-free variant satisfies RoHS environmental requirements.

About Slkor：

Slkor has research and development offices in Busan, South Korea, Beijing, China, and Suzhou, China. Most of the wafer manufacturing and packaging and testing are carried out within China. The company employs and collaborates with individuals and organizations worldwide, with a laboratory for product performance and reliability testing and a central warehouse located at its headquarters in Shenzhen. Slkor has filed for over a hundred invention patents, offers more than 2,000 product models, and serves over ten thousand customers globally. Its products are exported to countries and regions including Europe, the Americas, Southeast Asia, and the Middle East, making it one of the rapidly growing semiconductor companies in recent years. With well-established management systems and streamlined workflows, Slkor has rapidly enhanced the brand awareness and reputation of its "SLKOR" brand through its outstanding quality and standardized services. Its product range includes three major series: diodes, transistors, and power devices, with recent introductions of new products such as Hall elements and analog devices, expanding its presence in sensors, Risc-v microcontrollers, and other product categories.

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