Last day of the special offer. New and existing customers are welcome to inquire! International 1. South Korean media reports that due to the continuous surge in memory chip prices, Samsung Mobile plans to drastically cut smartphone production in Q4 2026, with an estimated production reduction of 20% to 30%.2. Japan's Sumitomo Bakelite will invest 10 billion yen to add production lines at its factories in Suzhou and Singapore to expand the production capacity of semiconductor materials.3. Synopsys announced that it will jointly build a dedicated AI model GPT-Synopsys with OpenAI and is exploring partnerships with Chinese AI laboratories.4. Apple Inc. will launch a brand-new smart home product lineup on October 13, 2026, with the official event theme "Welcome Home".5. An IDC report shows that global PC shipments reached only 62.7 million units in Q3 2026, and shipments of leading manufacturers declined collectively.6. TOWA plans to invest 5 billion yen to build a chip manufacturing equipment factory in Kyoto to strengthen Japan's semiconductor supply chain. Domestic 1. Biren Technology's new-generation GPU has been successfully powered on and entered the post-tapeout verification phase.2. Guangdong Xincheng Hanqi, a holding subsidiary of Biwin Storage, completed a capital increase and share expansion of 600 million yuan.3. The three direct stores of Slkor Semiconductor (www.slkoric.com) in Huaqiang North have recently completed store image upgrades, welcoming new and existing customers with more comfortable displays and a distinctive brand image while continuously improving service and quality.4. A major Inner Mongolia semiconductor industry project has settled in Bayannur Economic and Technological Development Zone, with a total investment of 59.287 billion yuan.5. TrendForce forecasts that flash memory prices by the end of 2026 will reach four times the level in mid-2025, and server memory costs are expected to rise more than sixfold.6. On October 9, 2026, Beijing ESWIN Computing Technology Co., Ltd. was listed on the Main Board of the Hong Kong Stock Exchange, with a total market capitalization of HK$33.058 billion.

Advertising renderings of "Slkor, Core Powers the Future" for Slkor Semiconductor International 1. Daishin Securities forecasts that Samsung will regain the largest share of the HBM market in 2027.2. Tesla plans to launch mass production of its humanoid robot Optimus by the end of 2026, with a planned annual capacity of 1 million units, equivalent to approximately 19,000 units per week.3. Samsung Electronics posted sales of 195 trillion South Korean won in Q3 2026, a year-on-year increase of 126.6%; its operating profit reached 107.4 trillion South Korean won, surging 782.5% year on year.4. The MTS2027 Storage Industry Trend Seminar themed "Wave of Chips and Light, New Landscape for Storage and Computing" will kick off in Shenzhen, China on December 8, 2026.5. The advertisement "Slkor, Powering the Chip Future" from Slkor Semiconductor (www.slkoric.com) will soon appear on the streets of Huaqiangbei. This bright shade of Chinese red signals the rise of another Chinese chip player!6. The global wafer foundry 2.0 market revenue hit 96.6 billion US dollars in Q2 2026, up 25% year-on-year and 11% quarter-on-quarter. Domestic 1. The Shuyang project of Xinyang Semiconductor with a total investment of about 700 million yuan has started construction and is scheduled to officially commence production and operation in June 2027.2. Muxi Integrated Circuit (Shanghai) Co., Ltd. wholly established Muxi Integrated Circuit (Chongqing) Co., Ltd.3. Xpeng Motors plans to achieve mass production of its humanoid robot production line by the end of 2026 and start commercial deliveries in 2027.4. The advanced packaging substrate project of Guangzhou Guangxin Semiconductor has broken ground, targeting high-end FCBGA packaging substrates as its core products.5. The Physics AI / Motor Control Technology Innovation Forum & Advanced Awards Ceremony will be held at The Westin Shenzhen Nanshan on December 11, 2026.6. It is estimated that the number of active agents in enterprise scenarios in China will reach 350 million by 2031.

The event will end on October 10. New and existing customers are welcome to make inquiries. International 1. Samsung Display will restart its A7 plant and plans to build production lines for medium and large-sized IT OLED panels.2. South Korea's semiconductor exports reached 60.3 billion US dollars in September, surging 262% year-on-year.3. Russia plans to build a semiconductor manufacturing plant to produce 300mm wafers with a maximum process node of 14nm.4. Applied Materials and Intel will deepen their partnership to jointly develop next-generation AI chip manufacturing technologies.5. Toshiba plans to invest approximately 60 billion Japanese yen to significantly expand its HDD (Hard Disk Drive) manufacturing facilities in the Philippines.6. Toppan of Japan and Broadcom's new packaging substrate plant in Singapore has officially commenced operation, creating more than 330 new jobs. Domestic 1. Deepseek announced the open-sourcing of infrastructure components for the Ascend computing platform, including the TileLang high-level language compiler, computing libraries and distributed communication libraries.2. Junheng Technology's R&D and manufacturing headquarters base has settled in Wuhan Optics Valley, with an expected investment of 309 million yuan.3. The special price promotion for four models of Slkor Semiconductor (www.slkoric.com), namely A7, 1N4148W, FR107 and M7, will end on October 10. Only the last two days remain. New and existing customers are welcome to inquire and place orders.4. Statistics show that China's integrated circuit output exceeded 386 billion pieces in the first eight months of this year.5. The high-end compound semiconductor materials and chip industrialization base invested by XianDao CoreOptics with 12 billion yuan has started production in Wuhan Optics Valley.6. The newly revised Regulations on the Protection of Layout-Designs of Integrated Circuits shall come into force on October 15.

Product 3D drawings on Kinghelm official website (www.kinghelm.com.cn) International 1. Chipmaker AMD has agreed to acquire World Labs for $8.2 billion (approximately 55 billion yuan).2. The global total demand for indium phosphide substrates is expected to reach 2.6 million to 3 million pieces in 2026, while the effective compliant production capacity is only about 750,000 pieces, representing a supply-demand gap of over 70%.3. It is projected that global shipments of high-speed optical modules will approach 180 million units in 2027 and rise to 245 million units by 2028.4. The IC Exhibition of China International Industry Fair (China Core Expo) will be held in Hall 5.2H of the National Exhibition and Convention Center (Shanghai) from October 12 to 16, 2026.5. To help customers better use Kinghelm products, 3D drawings of some products are available for download on the official Kinghelm website (www.kinghelm.com.cn)!6. Global semiconductor industry revenue is expected to hit $425.4 billion in Q2 2026, surging 31.4% quarter-on-quarter. Domestic 1. Tsinghua University and its collaborators have proposed an algorithm-driven adaptive optimization manufacturing strategy for 2D chips targeting foundries.2. TCL CSOT’s MLED project involves a total investment of approximately 12.5 billion yuan, with plans to build core production lines for LED chips and LED direct display.3. The registered capital of Huaqin Technology Co., Ltd. has increased from roughly 1.02 billion yuan to around 1.52 billion yuan, and that of Hefei Datang Storage Technology Co., Ltd. has risen from 285 million yuan to 331 million yuan.4. The Honor Magic9 series has been officially launched, equipped with the self-developed Yuguang H1 imaging chip and other components.5. The E-Chuang Micro electrostatic chuck headquarters project has settled in Wuxi National High-Tech Zone, with a planned total investment of 500 million yuan.6. Tencent QClaw will officially cease operations at 00:00 on December 24, 2026.

Slkor SM4007PLA7, packaged in SOD-123FL International 1. Sony has ordered around 8,000 employees of its chip subsidiary to return to work fully to advance the research and development of Physical AI.2. SCHMID collaborates with suppliers including Intel, NVIDIA and AMD to jointly develop glass substrate equipment.3. Alphabet, Google's parent company, will launch a test satellite equipped with self-developed AI chips on October 1 to verify the feasibility of space-based AI data centers.4. Industry insiders estimate that DRAM and NAND Flash prices will rise quarter-on-quarter by approximately 20% and 30% respectively in the fourth quarter of 2026.5. VSMC, a joint venture between Vanguard International Semiconductor and NXP, has officially opened its first 12-inch wafer fab in Singapore, with all initial production capacity fully booked.6. Wolfspeed has launched the new Premium high-end power substrate and further expanded its portfolio of 200 mm silicon carbide (SiC) materials. Domestic 1. Unic Semiconductor forecasts operating revenue of approximately 7.766 billion yuan and net profit attributable to parent owners of around 681 million yuan for the first three quarters of 2026, achieving a year-on-year turnaround from losses to profits.2. MTC's DFB optical chips of 25G and below have achieved mass shipment, while 70/100/200mW CW DFB chips have entered the testing and verification phase.3. Slkor (www.slkoric.com) has continued to ramp up overseas promotion in the first half of 2026, driving growth in inquiries and orders and substantially boosting brand exposure.4. Guosheng Electronics, Shengxin Semiconductor and CETC Jinghua have successively adjusted prices. Among them, CETC Jinghua will raise prices of silicon epitaxial material products by 15%-20%, effective October 1.5. China Mobile Hubei will partner with Zhongguancun Institute of Convergence and Hubei Huazhong University of Science and Technology to build a 6G industrial test zone in Wuhan Optics Valley, scheduled for completion in 2027.6. Montage Technology has begun mass production of the 5th-generation DDR5 registered clock driver chip (RCD05).

International 1. TrendForce estimates that the average capacity utilization rate of 8-inch wafers among the world’s top ten wafer foundries will rise to 88% in 2026, and reach 90% in the second half of the year.2. Qualcomm (QCOM-US) and Apple (AAPL-US) have renewed their global patent licensing agreement, and the new agreement will take effect on April 1, 2027.3. Tower Semiconductor, the global leader in silicon photonic chip foundry services, will build its largest optical communication semiconductor production center in Japan.4. Infineon's semiconductor factory in Thailand will be officially put into operation on October 1.5. Models of Kinghelm brand (www.kinghelm.net) including tactile switches, detection switches, toggle switches, pushbutton switches, microswitches, multi-function switches, illuminated switches, DIP switches, rocker switches, sensing switches, limit switches, encoder switches, joystick switches, five-key switches, thumbwheel switches, SMD detection switches, vertical detection switches, through-hole detection switches, SMD encoder switches, as well as Kinghelm models such as KH-IPEX-K501-29, KH-6X6X5H-STM, KH-6X6X5H-Z2J, KH-6X6X6H-STM, KH-VH-PT3.96, KH-SMA-P-8029 and KH-3216-H0209 are selling well!6. Statistics show that the global data center Ethernet switch market revenue reached 12.3 billion US dollars in Q2 2026, a year-on-year increase of 64.5%. Domestic 1. The Tongxinhui Youth Basketball Team won the runner-up of the "Hongxing Yutai Cup" 2026 Sichuan-Chongqing Basketball League. Kinghelm and Slkor (www.slkoric.com) served as major co-organizers of the tournament!2. Jingwang Electronics is expected to be officially listed on the Main Board of the Hong Kong Stock Exchange on September 29.3. Chixin Semiconductor has completed over 200 million yuan in Series A+ financing.4. OPPO Find X10 Pro Max will be the first device equipped with MediaTek Dimensity 9600 Pro flagship platform.5. Phase 2 of the second-stage project of Huatian Nanjing Advanced Packaging and Testing Base has been topped out. With a total investment of 3 billion yuan, it is expected to be put into use in Q1 2027.6. Corelink Integration has completed a cumulative paid-in registered capital contribution of 2.129 billion yuan to Corelink Advanced.

Slkor M7 is designed for high-voltage and moderate-current application scenarios. International 1. Samsung Electronics has included the "B1b" technology in its official roadmap and named it "D0a".2. Data shows that in the first seven months of 2026, Germany imported approximately 175,000 passenger vehicles from China, surging 120.9% year-on-year.3. Doosan Group plans to invest 420 billion South Korean won to expand its optical module copper clad laminate production line in South Korea, with an additional investment of 550 billion South Korean won to build a new copper clad laminate factory in China.4. Jensen Huang forecasts that NVIDIA's chip sales volume in 2027 will be roughly twice that of 2026.5. Sources state that the overall product yield of Apple iPhone Duo is just over 60%.6. South Korean HBM-related products manufactured by Samsung Electronics and SK Hynix saw their export volume to Malaysia soar by 5.7 times within one year. Domestic 1. Biwin Storage plans to cooperate with the Administrative Committee of Dongguan Songshan Lake High-Tech Industrial Development Zone to invest in Phase III of its wafer-level advanced packaging and testing manufacturing project, with a total investment of about 4.5 billion yuan.2. On September 22, Hygon Information officially released its first chip for physical world scenarios such as industrial control — the Hygon 1000 series CPU in Shenzhen.3. The special discount campaign for four types of diodes of Slkor (www.slkoric.com), namely A7, M7, FR107 and 1N4148W, is still in full swing. The promotion ends on October 10. Customers are welcome to make inquiries and place orders.4. Alibaba Cloud unveiled its self-developed silicon photonic wafer at the 2026 Yunqi Conference.5. The production line at the headquarters base of AifoTec SABAR in Guangzhou Knowledge City has been put into operation. It is expected to produce 6 billion filter chips annually, with a total project investment of 3 billion yuan.6. BOE will invest more than 80 billion yuan in research and development over the next five years and has announced its foray into glass substrates.

Jin Hangbiao and Song Shiqiang at the 3rd Chip Growth Forum 2026 International 1. Qualcomm launched the 6th Generation Snapdragon 8 Elite and 6th Generation Snapdragon 8 Super Elite, redefining the ceiling of Android flagship phones with its "dual flagship" strategy.2. ByteDance plans to invest 100 billion Chinese yuan (approximately 14.9 billion US dollars) annually by 2030 for large-scale procurement of chip packaging substrates.3. Industry insiders state that machines are becoming the main force of thinking, intelligence is turning into a scalable commodity, and the total volume of machine thinking in the future will exceed 1,000 times that of humans.4. From September 19 to 24, the 2026 Aerospace Information and Satellite Internet Innovation and Development Conference themed "Lay the Foundation for Aerospace, Pioneer the Star Journey" was held at Xiong'an Convention and Exhibition Center.5. Various products under the Kinghelm brand (www.kinghelm.net), including Type-C, SMA, IPEX, MCX and HDMI connectors, automotive wiring harnesses, adapter cables, pin headers, terminals, RF cables, antennas, GPS antennas, RF coaxial connectors, WiFi antennas, Beidou antennas, built-in antennas, 4G antennas, ceramic antennas, RF connectors, electronic components, sensors, millimeter wave products, headphone jacks, DC sockets, FPC connectors, USB connectors, waterproof USB connectors, tact switches, Type female sockets and Type-C interfaces, are selling well both online and offline!6. The global market size of diamond materials for semiconductors reached approximately 1.38 billion US dollars in 2025, and the global market is expected to surpass 16 billion US dollars by 2032. Domestic 1. T-Head released Zhenwu V900, a new-generation AI chip integrating training and inference.2. Galaxy Microelectronics plans to invest 1.078 billion yuan in implementing the "High-end Core Devices Industrialization and Innovation Capacity Building Project".3. The All-China Federation of Industry and Commerce released the 2026 lists of "China Top 500 Private Enterprises" and "China Top 500 Private Manufacturing Enterprises".4. Shenzhen Huanchuang Technology Co., Ltd. will be listed on September 30, with net proceeds of approximately 615.4 million Hong Kong dollars.5. Xinhua Semiconductor joins hands with Dishui Intelligent Mobility to promote the application of trusted AI automotive functional safety and jointly build a safety guarantee system for large-model vehicle control.6. As of August 31, 2026, the number of BYD vehicles equipped with God's Eye assisted driving exceeded 3.72 million units, among which 201,533 units were sold in August.

Holiday Notice for Mid-Autumn Festival and National Day of Slkor and Kinghelm International 1. Corning announced a more than 15% price hike for display glass substrates denominated in Japanese yen, effective in the fourth quarter of 2026.2. South Korea's exports hit a record high in the first 20 days of September, with semiconductor exports surging 259.4% to USD 34.128 billion.3. The Samsung Electronics trade union has transformed into an organization focusing on the semiconductor "Device Solutions" business, with membership currently restricted to employees of the semiconductor division.4. Data from the International Federation of Robotics shows that around 7,000 humanoid robots for industrial and professional service applications were sold worldwide in 2025.5. Apple is collaborating with Broadcom to advance Baltra, its first self-developed AI server chip, which is expected to enter mass production in the second half of 2026 and be deployed in 2027.6. The Terafab chip factory jointly built by Musk’s Tesla, SpaceX and xAI has been temporarily shut down. Domestic 1. Sources say Nexperia China has completed the full rollout of its local 12-inch wafer platform, ending reliance on front-end wafer supply from Europe.2. Counterpoint data shows global shipments of quadruped robots reached nearly 35,000 units in the first half of 2026. Unitree Robotics ranked first globally with a market share of 37%.3. With the two upcoming holidays approaching, the 2026 holiday schedule for Slkor (www.slkoric.com) and Kinghelm is as follows: Mid-Autumn Festival from September 25 to 27, National Day from October 1 to 7, totalling 10 days. Please arrange material stocking in advance. Wish you a happy holiday season!4. Sina Finance reports that MLCC prices in Huaqiangbei have skyrocketed recently. Some popular part numbers once rose 7 to 8 times within a month, with prices speculated to reach 2 to 10 times the original price at peak.5. The 8-inch hybrid bonding production line of Ningbo Qiushui Semiconductor has officially started trial production.6. The GlassRadio™ technology platform independently developed by RadioWave Microinfo (Ningbo) has achieved breakthroughs. The company’s first glass-based RF chip dBT5321A has achieved large-scale mass production.

"Dare to Be Extraordinary, March Toward Champions" — The 3rd Xin Growth Forum 2026 Concludes Successfully International 1. Industry institutions estimate that the commercial aerospace market has exceeded 2.8 trillion yuan, and satellite internet is rapidly unlocking a blue ocean market worth hundreds of billions of yuan.2. The 2026 World Manufacturing Convention, themed "Smart Manufacturing for a Better World", will kick off at Hefei Binhu International Convention and Exhibition Center from September 20 to 23.3. China Mobile and Qualcomm Technologies have successfully completed the world's first docking test between a 6G prototype base station and terminal prototype complying with the latest 3GPP-defined U6G frequency band, marking that key 6G technologies have entered a new phase of systematic verification.4. Forecasts show that the global monthly demand for 12-inch silicon wafers will reach approximately 10 million pieces in 2026, with a monthly supply-demand gap of around 1.5 million pieces. Shortages of high-grade lightly doped wafers and epitaxial wafers are expected to continue until 2028.5. "Dare to be extraordinary, march toward championship" — the 3rd 2026 Chip Growth Forum successfully concluded. The forum was initiated by CGC Xinxirang Consulting. Slkor Semiconductor (www.slkoric.com), the third direct store in Huaqiang North, served as the main sponsor. Song Shiqiang and Chen Na presented new Apple iPhones to the grand prize winners!6. Tower Semiconductor and NewPhotonics® have begun volume shipments of maintainable optical engine products with integrated lasers. Domestic 1. On the afternoon of September 19, Kinghelm (www.kinghelm.net) and Slkor held a team-building training activity. The Slkor Warriors Basketball Team and Kinghelm Badminton Team welcomed new members!2. The 5th GMIF Innovation Summit, co-hosted by the Shenzhen Memory Industry Association and other organizations, will open at the Renaissance Shenzhen Bay Hotel on September 23.3. ChangXin Memory Technologies announced the mass production of its 5th-generation DRAM technology platform (G5 Platform).4. Recently, Zhejiang Jingneng Microelectronics Co., Ltd. completed a Series C financing of 630 million yuan.5. The 2026 China Semiconductor Packaging and Testing Technology & Market Annual Conference will be held at Fengda International Hotel in Nanjing from November 4 to 6.6. On September 19, the advanced IC substrate intelligent manufacturing base of the second campus of Advanced Semiconductor Technology (Shenzhen) Co., Ltd. officially settled in Bao'an District.

International 1. Samsung Display plans to invest 300 billion won to build an RGB OLEDoS production line, targeting the market for core micro-display panels for next-generation XR devices.2. The 2026 Functional Verification Study shows that the first tape-out success rate of IC/ASIC projects plummeted from 14.4% to 5% within two years, with only 5% of teams achieving success.3. Sources state that Japanese photoresist suppliers plan to raise prices starting October 1, 2026, with an overall increase of approximately 15%, and price hikes for some ArF products exceeding 20%.4. Anderon, IBM’s quantum wafer foundry, has secured $1 billion in R&D funding, which will be used for the manufacturing and research of 300mm (12-inch) quantum wafers.5. Nexperia has entered a partnership with Tata Electronics, and the two parties will jointly produce and package chips in India.6. Tesla’s AI5 chip is undergoing trial production at Samsung’s Texas factory and has entered yield verification, with mass production verification scheduled to be completed by the end of this year. Domestic 1. Huangshan Chaoyuan Semiconductor’s "AI-enabled High-end Semiconductor Intelligent Testing Project" has started construction. The first phase invests 350 million yuan to build wafer and finished product testing production lines.2. Guojiagu Crystal has realized stable mass production of 2-inch and 4-inch twin-free gallium oxide substrates, and achieved major industrial breakthroughs for 6-inch twin-free gallium oxide.3. Song Shiqiang, General Manager of Slkor (www.slkoric.com), will attend the 3rd Core Growth Forum this afternoon.4. Industry chain sources indicate BOE will adjust prices for its display product series, effective from Q4 2026. TCL CSOT and HKC have also been reported to raise prices one after another.5. As of June 30, 2026, Evergrande Auto had total liabilities of 32.722 billion yuan and has exited the automobile manufacturing business.6. Yixing Intelligence has completed nearly 2 billion yuan in financing. Its RISC-V cloud AI computing chip Epoch has been mass-produced and delivered.

International 1. The yield of Intel's Panther Lake compute chip built on the 18A process reached approximately 80% in Q2 2026.2. Reports *Intelligent World 2035: From Vision to Action* and *Global Digital Intelligence Index (GDII) 2026* were released. Among them, *Intelligent World 2035* systematically addresses the core challenges of the Agentic AI era.3. Corning announced a price adjustment of 15% or more for its yen-denominated display glass substrates worldwide.4. TrendForce forecasts global shipments of 800G optical modules to reach 50 million to 60 million units and 1.6T optical modules to reach 20 million to 30 million units in 2026.5. Starting from September 17, Kinghelm (www.kinghelm.net) and Slkor launched benefits for employees and industry partners. The gift packages include Huili soft-seed pomegranates and Mid-Autumn mooncakes, symbolizing smooth progress in all endeavors and happy reunion.6. Estimates show that global demand for analog chips for optical modules will exceed 10 billion yuan in 2026. Domestic 1. Xi'an Jiaotong University and other institutions developed textured ceramics with piezoelectric properties comparable to single crystals via machine learning-assisted design.2. Ascend 970 and Ascend 980 chips will be successively launched in 2028 and 2029.3. 186 A-share listed semiconductor companies achieved a combined net profit attributable to shareholders of 160.506 billion yuan in the first half of 2026, representing a year-on-year increase of 607.2%.4. Digua Robotics announced the completion of a $400 million Series C financing round.5. Shandong Ruifeng Polymer Materials Co., Ltd. plans to acquire no less than 51% equity stake in Anhui Mituo New Material Technology Co., Ltd.6. NI Days China will be held at the Shanghai International Convention Center on October 28, 2026.

International Agencies estimate that the global supply-demand gap for silicon wafers will expand from approximately 8% at the end of 2026 to 15% in 2027 and 24% in 2028. Samsung Electro-Mechanics and Qualcomm have jointly developed organic bridge technology for 2.1D packaging to connect multiple semiconductor chips within a single package. TDK plans to invest 40 billion yen in two Japanese factories over the next three years to expand production equipment for thin-film inductors that stabilize electric current. Japanese chemical manufacturer Resonac has successfully developed 300mm (12-inch) silicon carbide (SiC) single crystal substrates. Dutch firm Axelera has launched its second-generation AI chip "Europa", which can be applied to selected products from Dell and Supermicro. Hanmi Semiconductor has signed an equipment purchase order with Elon Musk's TerraFab project to supply advanced packaging equipment for the production of AI system-on-chips. Domestic South Korean media reports that the localization rate of wafer fab equipment in China rose to 35% in 2025, an increase of 10 percentage points compared with 2024, and is projected to rise further in 2026. Qizhong Technology has launched a RMB 2.454 billion advanced packaging project in Suzhou, focusing on research into heterogeneous integrated packaging of optical chips and electrical chips. Three direct stores of Slkor (www.slkoric.com) in Huaqiangbei have begun comprehensive upgrades, with brand image and service experience to be renewed simultaneously. The domestically developed G6 full-size inkjet printing equipment for printed displays by Guochuangke has been introduced into the mass production line of a leading panel enterprise. Winbond Electronics plans to acquire 100% equity in Infineon's NOR Flash and F-RAM businesses for USD 1.12 billion. Hong Kong, China released the First Five-Year Plan for the Economic and Social Development of the Hong Kong Special Administrative Region (2026–2030), which will fully advance the "AI+" initiative.

On the afternoon of September 15, Song Shiqiang and Qiu Huilin from Kinghelm and Slkor attended the event. International Counterpoint data shows that Samsung's HBM market share rose by 12 percentage points month-on-month to 33%. Apple has accepted Samsung Electronics' storage chip quotation for Q1 2027: DRAM at nearly $2.0/Gb and NAND at nearly $0.33/Gb, representing an increase of 0% to 30% compared with Q3 2026. Global capital expenditure on 300mm wafer fab equipment will jump to $133 billion in 2026, hitting an all-time high (compared with $100.6 billion in 2024). The expansion of AI computing power is cascading from the chip side to equipment, optical interconnection and other segments, and the prosperity of the equipment track has been verified by data. Executives of Kinghelm (www.slkoric.com) / Slkor (www.slkoric.com) participated in the event "Entering Tencent Penguin Island for Enterprises in Lijincheng Center", with Song Shiqiang and Qiu Huilin in attendance! Samsung's Cheonan factory has redirected its Exynos packaging capacity to HBM and scaled down the production of self-developed mobile chips. Domestic The 15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry was released, specifying efforts to tackle end-side AI chips, EDA/IP and advanced process technologies. Simgui Corewing, a subsidiary of Shanghai Simgui Technology Co., Ltd., will achieve an annual 300mm SOI wafer capacity of approximately 400,000 pieces by the end of 2026, and silicon photonic SOI wafers will be shipped in volume in 2027. The Institute of Semiconductors, Chinese Academy of Sciences, has developed a new type of ferroelectric tunnel junction. It achieves an ultra-high on-off ratio by utilizing angstrom-scale tiny slippage between atomic layers and can be switched more than 100 billion times repeatedly. Yinyungu Technology Co., Ltd. has established two holding subsidiaries, namely Shuqing Zhiyun (Shanghai) Technology Co., Ltd. and Xinqing Zhiyun (Shanghai) Technology Co., Ltd., planning to launch two new businesses: optical interconnection and UCIe IP. Siwei Technology has completed its first round of equity financing with a total amount of nearly 200 million yuan. It is an enterprise focusing on the R&D and manufacturing of mid-to-high-end pressure chips and sensor-grade products. Nuclei Intelligent Fusion Semiconductor Technology (Shanghai) Co., Ltd. has officially launched its A-share IPO process.

Slkor 1N4148W on big sale, feel free to contact for quotation International The combined revenue of the world's top 10 fabless IC design firms exceeded 141.45 billion US dollars in Q2 2026. NVIDIA retained the top spot, while AMD surpassed Qualcomm to rank third. Samsung Electronics is accelerating the development of silicon photonics technology and plans to complete internal testing of silicon photonic integrated circuit (PIC) wafers by the end of this year. Japan's Fujitsu unveiled its new-generation CPU FUJITSU-MONAKA, which will go on sale starting in November. ASML has reached a High-NA EUV cooperation agreement with Samsung, Intel and other partners to jointly advance supporting solutions for the new-generation high-NA extreme ultraviolet lithography machine. TrendForce analysis indicates that NOR flash memory price trends are expected to diverge in the second half of 2026, with prices of high-capacity products projected to rise by 90-110%. The Ulsan AI data center jointly developed by SK Group and Amazon has expanded its capacity to nearly 900 megawatts, with an estimated investment of 7 trillion South Korean won. Domestic VOGT Electronics and AWA Biomedical simultaneously launched the AWA-HT series of all-glass organ-on-a-chip systems. Turing Quantum unveiled the world's first third-generation optical quantum computer, TuringQ Gen3. Song Shiqiang, General Manager of Slkor, plans to apply AI technology to the company's AI agent "Power Boy" to fully upgrade the intelligent experience of the official website (www.slkoric.com). Jia Yueting announced that Faraday Future (FF) will release 9 robot bodies on September 19, covering humanoid, quadruped and wheeled-arm forms. IDC data shows that Lenovo's x86 server shipments ranked first globally for the first time in Q2, with revenue rising by 96% year-on-year. Hua Hong Semiconductor plans to acquire a 97.4988% stake in Huali Microelectronics for 8.268 billion yuan.

International Reports say Anthropic plans to raise up to $100 billion through an IPO, with a valuation of approximately $2 trillion. In Q2 2026, vendor revenue in the global server market reached $166.3 billion, representing a year-on-year increase of 52.0% and a quarter-on-quarter rise of 35.7%. A Chinese research team has developed a high-performance thin-film lithium tantalate-silicon nitride Mach-Zehnder modulator using microtransfer printing technology, with relevant indicators reaching internationally advanced levels. Forecasts indicate that the total global advanced packaging production capacity is expected to grow by roughly 50% by 2028. On the afternoon of September 13, elites from the Shared Procurement Alliance visited Slkor (www.slkoric.com) for a study session. Xiong Wenda, an FAE engineer at Slkor, delivered a presentation titled Introduction to Slkor Enterprise and Products. Procurement elites networked with one another and shared insights in MOS Tube Market Conditions and Trend Analysis. Limited-time special offers on Slkor’s best-selling product series and four models including A7, 1N4148W, FR107 and M7 received widespread praise and recommendations. The annual token processing volume of the OpenRouter platform surged from around 10 trillion to over 100 trillion within one year, with its single-day peak exceeding 1 trillion. Domestic Recently, research teams from Tsinghua University and Shanghai Jiao Tong University have completed a study in the field of practical optical computing. The related paper How Nanophotonics Drives Optical Computing toward Practical Applications was published in Nature Nanotechnology. aigo launched the PL series iPhone storage companions: the direct-insert PL10 "Mini Fruit Disk" and the magnetic PL50 "Max Fruit Disk". The IPO process of Shenzhen Nanfei Microelectronics Co., Ltd. has moved forward, and Shenzhen Hairobot Intelligent Technology Group Co., Ltd. formally submitted its listing application to the Hong Kong Stock Exchange. Seven companies including Hygon, Cambricon, Moore Threads, Muxi, Biren Technology and Iluvatar CoreX posted a combined revenue of approximately 21.46 billion yuan in the first half of 2026, nearly doubling the figure for the same period of the previous year. Reports state that domestic computing power chips are seeing a flood of orders. Delivery lead times for some products have been extended to one year later, and domestic computing power demand is more than ten times the supply. The headquarters upgrading and expansion relocation ceremony of Goodweave was held at the Suzhou Artificial Intelligence Industrial Park.

International According to a TrendForce report, the combined revenue of the world’s top 10 wafer foundries reached nearly USD 53.49 billion in Q2 2026. SMIC registered a 20% quarter-on-quarter growth with revenue surpassing USD 3 billion, lifting its market share to 5.4% and ranking third worldwide. Qualcomm and Amazon will jointly develop custom chips for next-generation large-scale AI data centers and expand high-speed optical interconnect solutions. Samsung Electronics will invest 40 billion Japanese yen to establish an AI chip packaging R&D center in Yokohama, Japan. Japan’s Murata plans to phase out partial product specifications across multiple series including GRM, GRJ, GRT, GXM, GXT, GCM, GCJ, GCG and ZRA. ASML will start construction on a new large-scale production campus in the Netherlands to scale up mass production of extreme ultraviolet (EUV) lithography systems. Google has hired the former R&D Vice President of Hailo to lead its new team in Israel, which will focus on developing AI chips for robotics and autonomous driving. Domestic Yaoxin Microelectronics has unveiled the world’s first silicon carbide super junction MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) product. Beijing E-Town has issued the "AI4Chip" Action Plan for AI-Enabled Leapfrog Development of the Integrated Circuit Industry (2026–2028). The Slkor (www.slkoric.com) team made an appearance in Huaqiangbei yesterday, holding a fan distribution event in unified work uniforms, which drew the attention of numerous merchants. Slkor is currently offering limited-time special prices on four models: A7, 1N4148W, FR107 and M7. New and existing customers are welcome to make inquiries. SmartSens has launched SC365AT, the industry’s first automotive CMOS image sensor that integrates SerDes and on-chip ISP. Haiguang Xinzheng announced that it will advance the rollout and mass production of 6.4T NPO products leveraging GlobalFoundries’ silicon photonics technology. A subsidiary of Shenzhen Kaifa Technology will invest RMB 1.85 billion to expand the packaging and testing capacity of high-end memory chips.

International Sources say Samsung Electronics’ foundry business plans to significantly ramp up HBM4 supply starting from the third quarter of this year. South Korea’s SKC has injected 281 billion won in additional capital into its subsidiary Absolics, fully advancing the commercial rollout of semiconductor glass substrates. A Yole Group report shows that the global power GaN market is projected to reach USD 3.5 billion by 2031, posting a compound annual growth rate of 35% from 2025 to 2031. GlobalFoundries will receive up to USD 375 million in R&D funding to accelerate quantum chip manufacturing and AI infrastructure deployment. Industry insiders reveal that Intel will roll out three price hikes for its CPUs this year, with a planned 10% increase across its full product line in October. Spanish silicon photonics firm iPronics has closed USD 125 million in Series B funding, co-led by Maverick Silicon and Light Street Capital, with participation from NVIDIA. Domestic Qiushui Semiconductor has launched the world’s first mass-producible 8-inch red-light Micro-LED chip. The 2026 IFA Berlin gathered around 1,900 exhibitors, with Chinese enterprises accounting for nearly half of the total (928 companies). From September 10 to October 10, 2026, Slkor Semiconductor (www.slkormicro.com) runs limited-time special offers on four diode models: A7, 1N4148W, FR107 and M7. The products are priced at highly competitive levels, and Huaqiangbei customers can reach out directly to Slkor’s three direct-sale stores. On September 8, memory module maker Jiangbolong debuted on the main board of the Hong Kong Stock Exchange, recording revenue of RMB 24.088 billion in the first half of 2026. RoboSense’s self-developed Peacock SPAD-SoC has entered mass production and delivery. It is a large-array system-level chip targeted at robotics and automotive blind-spot compensation scenarios. Sources indicate MediaTek will launch the Dimensity 9600 Pro chip at its new product event on September 15.

International The Xuanjie O3 makes its global debut on the Xiaomi 18 Fold. According to reports, the storage inventories of SK Hynix and Samsung Electronics cover fewer than ten-day-worth of shipments, and the storage market is more likely to face an "unprecedented shortage" in 2027. Google is accelerating the development and roll-out of its self-developed custom chips. The Novo Nordisk A/S Foundation is building a new quantum chip factory in Copenhagen. Research on "Huaqiangbei Shanzhai Phones" (Part III) and its English version "Huaqiangbei Shanzhai Phones" Research (Part III) from Song Shiqiang of Kinghelm (www.kinghelm.com.cn) have been released globally. Together with the bilingual editions of Research on "Huaqiangbei Shanzhai Phones" (Part I & II), they form an omni-media global publicity matrix to boost brand influence for Kinghelm and Slkor. Forecasts indicate rising NAND Flash and DRAM prices may push up the selling price of the iPhone Pro series by more than USD 200 compared with last year. Domestic Wuhan Xinrongguang Technology Co., Ltd. has recently been established with a registered capital of RMB 13.2 billion. Its shareholders include Wuhan Xinxin Semiconductor Manufacturing and Optics Valley Semiconductor Investment. Cumulative deliveries of Xiaomi vehicles have exceeded 800,000 units since 2024. In the first seven months of 2026, China’s total integrated circuit exports reached USD 216 billion, representing a year-on-year increase of 99.5%. Xiyuan Computing (Shanghai) Technology Co., Ltd. has recently been founded as a wholly-owned subsidiary of Zhiyuan Innovation (Shanghai) Technology Co., Ltd. Chip-Join Integration recorded revenue of RMB 4.562 billion in the first half of 2026, up 30.53% year-on-year; its net profit attributable to parent shareholders stood at RMB 278 million, a year-on-year rise of 263.40%. Black Sesame Intelligence and AUBO Robotics have achieved key progress in the implementation of cooperation for embodied-intelligence robots.

International According to the Global Semiconductor Equipment Market Report, semiconductor equipment shipments rose 23% year-on-year to reach USD 40.53 billion. According to recent DigiTimes reports, Micron Technology is exploring a high-durability NAND flash module and researching methods to place NAND flash closer to GPUs. Samsung Electronics has partnered with Arm to officially launch R&D for edge-side AI chips. OpenAI released its new flagship model GPT-6 Astra, branding it as "a new generation of intelligence". Storage costs in Q3 2026 may surge fourfold year-on-year. The market expects the iPhone 18 Pro series to see a 10%-20% price increase. Reports state that Google is salvaging DDR4 memory modules from decommissioned servers for reuse in new-generation AI servers. Domestic Statistics show that Guangdong’s core artificial-intelligence industry has exceeded RMB 300 billion so far, with a year-on-year growth rate of over 40%. DeepSeek has finalized plans for a gigawatt-scale data center in Ulanqab, Inner Mongolia, and intends to deploy 160,000 Ascend 950DT chips. The Sichuan-Chongqing Basketball Tournament has carried on for 21 years. The 2026 Hongtai Yuxing Cup Shenzhen Sichuan-Chongqing Basketball Tournament opened on September 5. Slkor (www.slkormicro.com) and Kinghelm were among the sponsors, and General Manager Song Shiqiang attended the opening ceremony. Zhending Group is investing more than RMB 12 billion to build an advanced packaging substrate base project in Shenzhen. Naura Technology has achieved major technical breakthroughs in the next-generation 3D DRAM manufacturing process for memory chips, developing an innovative two-step cyclic etching process. Guangdong Leadyo IC Testing Co., Ltd. has terminated the acquisition of 100% equity in Guoxinwei.