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41 Chinese chip projects stand out! The 2020 China Chip Application Innovation Summit Forum and IAIC Awards Ceremony were grandly held
2022-03-16 352

On November 27, 2020, the China Chip Application Innovation Summit Forum and IAIC Competition Awards Ceremony were grandly held in Songshan Lake District of Southern Software Park.


It is reported that this China Core Application Innovation Design Competition was launched in March. Nearly 300 projects across the country have participated, and a large number of China Core Application Innovation Projects have emerged. More than 300 guests from Chinese chip brands, well-known manufacturers in the electronic information industry, major media and top investment institutions witnessed this nationally focused innovation and entrepreneurship event. In the special application fields of the Internet of Things, artificial intelligence, smart terminals, medical electronics, and information security, many projects have achieved excellent market benefits and capital recognition.

Zhang Ge, General Manager of China Electronics Southern Software Park and Executive Director of Songshan Lake Park, Liu Guilin, Secretary of the Party Committee and Chairman of China Electronics International Information Services Co., Ltd., and Ouyang Nanjiang, Deputy Secretary of the Songshan Lake Party Working Committee and Director of the Management Committee, took the stage to deliver speeches and congratulations on the successful convening of the summit forum.
 

Picture: Zhang Ge, General Manager of China Southern Software Park and Executive Director of Songshan Lake Park

Picture: Liu Guilin, Secretary of the Party Committee and Chairman of China China Electronics International Information Services Co., Ltd.

Liu Guilin, Secretary of the Party Committee and Chairman of China China Electronics International Information Services Co., Ltd., said that China's modernization construction has entered a new stage. As the foundation of the electronic information industry, integrated circuits have become increasingly prominent, and special information security issues have become increasingly prominent. It has become a general consensus among the government and the industry to accelerate the improvement of China's local chip R&D and manufacturing levels, establish an ecosystem, and promote the rapid and healthy development of the semiconductor industry. We jointly witnessed a number of outstanding competition works that stood out in the IAIC competition, and jointly discussed the topic of building an industrial ecology. The project covers special application fields in the Internet of Things, artificial intelligence, smart terminals, medical electronics, and Xinchuang security, and has attracted the participation of many Chinese independent research and development chip companies such as BGI Beidou, Unisoc, Loongson, and Shanghai HiSilicon.

Picture: Ouyang Nanjiang, deputy secretary of the Songshan Lake Party Working Committee and director of the Management Committee


Experts from China's chip industry talk about chips

"Core" computing power service new infrastructure

"Core" ecological win-win new future
 

picture:Ms. Ke Guanyan, Tianjin Feiteng Information Technology Co., Ltd.

In the keynote speech session of China's core industry experts, Ms. Ke Guanyan of Tianjin Feiteng Information Technology Co., Ltd. first gave the keynote speech ""Core" Computing Power Serves New Infrastructure, "Core" Ecosystem Wins a New Future". She said that the new infrastructure has posed "four major tests" to the information industry and semiconductor industry. Feiteng will unswervingly promote technological innovation, continuously improve chip computing power, create a safe and trustworthy domestic computing system, and work with partners to build a prosperous and open ecosystem to accelerate the construction and development of cloud-edge-end full-stack solutions. Feiteng has begun to practice in cloud computing, big data, 5G, AI, transportation, energy and other fields, and has many typical applications. Feiteng will empower ecological partners with a more open mind and jointly embrace the dividends of new infrastructure.

GD32MCU: driving intelligent innovation with extensive layout

Mr. Jin Guangyi of Beijing GigaDevice Innovation Technology Co., Ltd. gave a keynote speech "GD32MCU: Driving Intelligent Innovation with Broad Layout", in which he introduced in detail the intelligent development trend and market demand of GD32MCU, the layout of GD32MCU in the "new infrastructure", and the layout of GD32MCU application development ecosystem.

Picture: Mr. Jin Guangyi of Beijing Zhaoyi Innovation Technology Co., Ltd.

Huada MCU - Shaping an unlimited future with a solid core

In his keynote speech "Huada MCU - Shaping the Infinite Future with Solid Cores", Mr. Zhang Jianwen of Huada Semiconductor Co., Ltd. first introduced the product layout of Huada MCU's four series of static, dynamic, intelligent and automotive products, and described the three hard-core features of Huada MCU: ultra-low power consumption, high reliability, and wide product layout (industry, automotive, home appliances and communications, etc.). Then the features of Huada's high-performance HC32F4A0 product were discussed in detail, including the use of M4F core, 240MHz main frequency, 2MB Dual Banke Flash, 516KB SRAM, rich analog peripherals, and support for HRPWM, EthernetMAC and EXMC. Finally, I introduced the Huada Semiconductor and MCU teams.

Picture: Mr. Zhang Jianwen of Huada Semiconductor Co., Ltd.
 

Market strategies and technical support for domestic chip application innovation

Loongson Zhongke is a high-tech enterprise incubated by the Institute of Computing Technology of the Chinese Academy of Sciences. The core team of the enterprise has insisted on independent research and development of the "Loongson" series of chips with completely independent intellectual property rights since 2001. It is the earliest team in my country to develop general-purpose CPUs and has strong technical accumulation. Mr. Jiang Shan of Guangdong Loongson Zhongke Electronic Technology Co., Ltd. talked about Loongson’s CPU development ecology from multiple dimensions.

Picture: Mr. Jiang Shan of Guangdong Loongson Zhongke Electronic Technology Co., Ltd.

Innovative application of Chinese cores in Chinese ships

Mr. Chen Gang, deputy chief engineer of Beijing CSSC Economic and Technological Development Co., Ltd., gave a keynote speech "Innovative Application of Chinese Chips in Chinese Ships". He introduced in detail that as the level of digitalization, networking and intelligence in the research and development, design, production and construction, navigation testing, and ship operations of the shipbuilding industry continues to improve, the cyber security risks in the shipbuilding industry continue to increase. Preventing and controlling network security risks and ensuring the stable operation of networks and information systems have become important aspects of network security standardization research.

Picture: Mr. Chen Gang, Deputy Chief Engineer of Beijing CSSC Economic and Technological Development Co., Ltd.

Reach a united front under the framework of 5G

Xi Yan, executive director of the Artificial Intelligence Research Institute of China Industrial Development Research Institute, gave a keynote speech "Achieving a United Front under the Framework of 5G". He said that 5G has become a key infrastructure for comprehensively constructing the digital transformation of the economy and society. It will promote the upgrading of the information consumption market, cultivate new momentum for social and economic development, and play an increasingly important role in promoting high-quality economic development. 5G brings elements from different fields together to form new productivity and new business formats. The Artificial Intelligence Research Institute of China Industrial Development Research Institute is directly under the National Development and Reform Commission and is responsible for the 5G training and 5G industry implementation of the Ministry of Industry and Information Technology. The institute will work with the industrial park to integrate some contestants into the 5G industry and commercialize them, and promote and replicate them across the country as soon as possible.

Picture: Xi Yan, Executive Director of the Artificial Intelligence Research Institute of China Industrial Development Research Institute

Strategic signing & expert recruitment

At the China Chip Application Innovation Summit Forum, under the witness of all the guests, Guo Xiaowen, general manager of Beijing CSSC Economic and Technology Development Co., Ltd., director of Guangdong CSSC Military-Civil Integration Research Institute, Zhou Jie, deputy general manager of China Electronics Port and general manager of Yinghuo Factory, and Tian Maoming, chief accountant of China Electronics Southern Software Park, came to the stage to sign a strategic cooperation agreement to jointly build the "Songshan Lake Marine Electronics Industry Base". The three parties will use the concept of integrating innovative resources and jointly promoting industrial development, relying on China State Shipbuilding Corporation to undertake national ship and ocean engineering projects and the actual needs of technological innovation for its own high-quality development, deeply explore the scientific and technological innovation achievements of many private technology enterprises in the Guangdong-Hong Kong-Macao Greater Bay Area, and promote the formation of a collaborative innovation industry cluster with ship and marine electronics characteristics.

The screening of China Chip Project and the selection of finals road show projects are inseparable from the careful review of the judging panel. A separate appointment ceremony for the expert judging panel was also arranged at this summit. The following is the list of this year’s expert judging panel:


At the end of the summit, the organizers also invited 8 award-winning entries with their own strengths in application forms, product innovation, market development, technology reserves, etc. to come to the stage to share their participation, and at the same time interact with the guests in the audience. It is understood that in order to better serve the innovation and entrepreneurship of college students with domestic chip application innovative technologies, the IAIC "China Chip" Application Innovation Design Competition has also opened a track for colleges and universities, and actively organized special technical practice training camps to help Chinese colleges and universities better integrate domestic leading chip products with teaching, cultivate innovative talents in the industry, and help future engineers and entrepreneurs better carry out innovation and entrepreneurship. Up to now, the college track has successfully completed the evaluation of 17 divisions across the country, and 31 teams have advanced. The finals of the college track will be held at the end of December, so stay tuned!

2020 China Core Application Innovation

Design Competition Award List

This China Chip Innovation Application Design Competition focuses on new infrastructure and exploring new opportunities, with five major directions: Internet of Things, artificial intelligence, information and security, medical electronics, and smart terminals. Since its launch in March, more than 300 projects across the country have signed up for the competition. A large number of outstanding Chinese core application innovation projects have emerged through the competition. They have combined China Core and started from application innovation to design a large number of distinctive Chinese core projects. In the end, 41 projects stood out, and three finals were held on November 26, 2020. After a wonderful project roadshow and expert scoring, multiple winners were finally selected and awarded at this summit forum. The following is the list of winners of this competition:

Special Prize

Intelligent EEG-controlled rehabilitation robot—Beijing Zhixing Wujiang

first prize

Nationally produced NVMeSSD solution—Beijing Yixin Technology

Advantech ROM-5780-SMARC core module - Advantech Technology

Second Prize

Infrared thermopile temperature measurement chip——Chuangxin Haiwei

High-precision 3D depth camera——Ningbo Xitang

AI dynamic vision intelligent terminal and operation platform—China Electronics Industrial Internet

Machine vision charging pile research and development and industrial application - Yidian Innovation


third prize

Connecting life in one flash - FlashEasy Technology

Small domestic PLC system for industrial Internet of Things - China Electronics Intelligence

Millimeter wave radar home monitoring series——Yunfan Ruida

Human face detection and tracking algorithm based on self-developed AI chip - Fangxin Technology

Fully integrated Doppler weather radar signal processing system based on domestic DSP - Chengdu Zhongdian Jinjiang

LaKi ultra-low power real-time wide area network technology - Qianmi Electronics

Excellent Project Award

Graphene smart defogging light mirror - OnePlus Technology

Wearable remote monitoring system—Shanghai Shiyuan Medical

Intelligent FOC motor drive——Taizhao Intelligent Control

Face recognition lock module——Fuge Technology

Application of light-sensing technology——Fumaos Technology

Smart home center based on 5G and Wi-Fi6 - Qiming Cloud

Operation and maintenance of IoT gateway——LazyYi Technology

Advantech EPC-R4710-Industrial Edge Intelligent Gateway—Advantech Technology

Blockchain IoT single chip——Hanshunlian Electronics

Smart Baby Guard Cradle——CRRC Times Semiconductor

Cross-platform embedded software development system—Qiming Cloud

Nenglian STAR routing protocol and system - Nenglian Technology


 

Feiteng Special Track Special Award List

Special Prize

Commercial-grade unified storage system based on Feiteng CPU - Beijing Tongyou Technology


first prize

Fully autonomous high-security delay-sensitive core switch——Fengyun Industrial

Second Prize

Great Wall's independent safe thin and light notebook UF7 series - Great Wall of China

A new generation of web application firewall based on Feiteng platform's multi-parallel operating systems - Tianrongxin

third prize

China Core’s domestic industrial control platform—Guangzhou High-Power Computer

Feiteng high-performance network information security computer—Shenzhen Rongda Computer

Domestic three-proof reinforced notebook EM-X14F——Edao Information

Distributed security engine high-performance firewall design based on new generation Feiteng processor - Tianrongxin

Four-channel high-performance computer based on domestic processor——Tong Taiyi

Product development based on Feiteng all-flash data backup management all-in-one server - Tiangu Xin'an

 

Excellent Project Award

Feiteng high-performance desktop terminal——Shenzhen Rongda

Domestic thin and light notebook - Yidao Digital

Situation analysis and security operation system——Tianrongxin

Product development based on Feiteng 5G white box base station server - Tiangu Xin'an

Feiteng Edge Gateway System——CLP Port


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