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On November 27, 2020, the China Chip Application Innovation Summit Forum and IAIC Competition Award Ceremony were held grandly at the Songshan Lake Park of Southern Software Park, marking the perfect conclusion of the 2020 China Chip Application Innovation Design Competition! More than 300 guests from Chinese chip brand companies, well-known manufacturers in the electronic information industry, major media and investment institutions were present to witness this seven-month innovation event. GigaDevice was invited to attend this event as a competition partner.
Since its launch in March, more than 300 projects across the country have signed up to participate in the IAIC competition, involving application fields such as the Internet of Things, artificial intelligence, smart terminals, medical electronics, and IoT security. After fierce competition, a large number of outstanding Chinese chip application innovation projects have emerged in this competition. This summit forum and competition also received strong support from guests and leaders from all walks of life related to the China Chip Ecological Chain. Guests included Ouyang Nanjiang, deputy secretary of the Party Working Committee of Songshan Lake and director of the Management Committee; Liu Guilin, Party Secretary and Chairman of China China Electronics International Information Services Co., Ltd.;
In the keynote speech session of China's core industry experts, Mr. Jin Guangyi, Marketing Director of GigaDevice Innovation Products, gave a keynote speech on "GD32 MCU: Driving Intelligent Innovation with a Broad Layout". He introduced in detail to the guests and the audience the extensive layout of GD32 MCU and the market services provided by "products + ecology" to become the leader in China's 32-bit MCU market.
According to Mr. Jin, since the launch of China’s first Arm Cortex-M core 32-bit general-purpose MCU in 2013, it has developed into the largest Arm MCU product family in China after 8 years. GD32 MCU continues to be more and more widely recognized by the market, shipments continue to rise, and the compound annual growth rate of sales reaches 201%. Up to now, GigaDevice has provided a variety of Cortex-M3/M4/M23/M33 Arm core product series, and also launched the world's first RISC-V core general-purpose 32-bit MCU product series in August last year. The GD32 MCU family provides broad coverage with more than 360 product models in 28 product series to meet the different development and design needs of more than 20,000 customers around the world. It is widely used in industrial control, consumer electronics, medical equipment, automotive peripherals and other fields. It continues to lead the Chinese MCU market with annual shipments exceeding 150 million units and cumulative shipments exceeding 500 million units.
Mr. Jin said that GigaDevice’s innovative MCU products promise a 10-year long-term supply guarantee and provide various stable mass production solutions for customers in industrial control, consumer electronics and automotive peripherals to carry out electronic system design. In the future, we will continue to launch a variety of MCU products such as ultra-high performance, ultra-low power consumption, radio frequency, automotive grade and analog signal chain. While leading in the general field, we also continue to pay attention to market segments. We have currently launched dedicated MCUs including optical modules, printers, fingerprint recognition and other fields. Taking the optical module market as an example, GD32 MCU has launched the GD32E232 series for medium and low-speed application scenarios such as 2.5G OLT, 10G PON, and 25G fronthaul based on the different transmission rate requirements of optical modules, and the GD32E5 series for medium- and high-speed application scenarios such as data centers and cloud servers, providing a complete solution for domestic substitution in the optical module optical communication market. In the field of fingerprint recognition, it has also matured and mass-produced "fingerprint sensor + MCU" smart door lock solutions.
According to Mr. Jin, GD32 is also committed to creating GigaDevice innovative multi-product linkage, constantly exploring the MCU controller as the core, combined with sensors, analog peripherals, and various memories to provide better intelligent application examples for embedded systems and terminals, including radio frequency, new storage, hardware accelerators, signal chains, real-time interconnection, photoelectric transmission, power management, power control, and smart sensors.
At this China Chip Summit Forum, Mr. Jin emphasized that while international MCU manufacturers are still using 90nm and 55nm processes as the mainstream, GD32 MCU has continued to evolve and develop. The latest products have adopted the 40nm low-power process for stable mass production, and they are also constantly exploring 22nm process planning. In terms of product supply, GigaDevice has long-term cooperation with SMIC, Taiwan UMC, and TSMC. It adopts the method of simultaneous certification and supply by multiple wafer factories and multiple packaging and testing factories, and gathers resources from multiple production lines to cope with the general shortage of goods and price increases in the semiconductor market in the second half of this year. It provides customers with confidence and production capacity guarantee, and fully validates the strength and responsibility of the market's leading brands.
The extensive layout is not only reflected in products, but also in services. GD32 continues to work with global partners to build a complete MCU ecosystem, launching a variety of development environments IDE, development kit EVB, operating system RTOS, graphical interface GUI, security components and cloud connection solutions. It also provides various series of video tutorials and short videos on the technology website for on-demand online learning at any time. The rich development ecosystem provides convenience and guarantee to customers.
In terms of talent training, GigaDevice Innovation has launched a comprehensive talent training system to cultivate and deliver talents for China's embedded industry in four interlocking aspects: youth science popularization, higher vocational and technical skills training, university planning and postgraduate education. As Mr. Jin said at the meeting, cooperation with China Electronics in the IAIC competition is a concrete practice of GigaDevice in promoting talent training and encouraging innovation and entrepreneurship. It is great to see that the works designed by the contestants using GD32 MCU have won multiple competition awards and achieved excellent results. GD32 MCU is willing to be a good mentor and friend to developers, a tool for displaying their creative talents, and accompanies everyone to grow together.
Expert recruitment & project presentation
The screening of China Chip Project and the selection of finals road show projects are inseparable from the careful review of the judging panel. A separate appointment ceremony for the expert judging panel was also arranged at this summit. The following is the list of this year’s expert judging panel:
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Special Assistant to the General Manager of BGI Beidou |
Jian Zhihong |
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Vice President of Sales, Tianjin Feiteng |
Guo Jingyi |
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GigaDevice Innovation Product Marketing Director |
Jin Guangyi |
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Manager of Planning and Development Department of Huada Electronics |
Zhang Jianwen |
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Chief Scientist of Shengbang Microelectronics |
Yao Ruoya |
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Marketing Technology Director of Shanghai HiSilicon Platform and Solution Marketing Department |
Chen Jian |
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General Manager of Guangdong Loongson Zhongke Electronics |
country |
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Fuluikun Vice President of Microelectronics |
Niu Zhao |
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Civil Aviation Investment Fund-Vice President of Aviation Investment Group |
Kang Yongfeng |
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General Manager of Zero Degree Capital |
Wang Jiewen |
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Danen Capital Partners |
Liu Xu |
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General Manager of TCL Shifang Vertical Industry Technology |
Zou Yu |
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Chief Lecturer of Jiayuan Consulting |
Li Xiaoke |
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Executive Vice President of Guangdong CSSC Military-Civil Integration Institute |
Jiang Bin |
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Deputy Chief Engineer of China China Electronics International Information Services Co., Ltd. |
Fang Zenan |
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Deputy Secretary of the Party Committee of China Ruida Investment and Development Group Co., Ltd. |
Ma Xinfeng |
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Deputy General Manager of CLP Port Yinghuo Factory |
Liu Zhigang |
At the end of the summit, the organizers also invited 8 award-winning entries with their own strengths in application forms, product innovation, market development, technology reserves, etc. to come to the stage to share their participation, and at the same time interact with the guests in the audience. It is understood that in order to better serve the innovation and entrepreneurship of college students with domestic chip application innovative technologies, the IAIC "China Chip" Application Innovation Design Competition has also opened a track for colleges and universities, and actively organized special technical practice training camps to help Chinese colleges and universities better integrate domestic leading chip products with teaching, cultivate innovative talents in the industry, and help future engineers and entrepreneurs better carry out innovation and entrepreneurship. Up to now, the college track has successfully completed the evaluation of 17 divisions across the country, and 31 teams have advanced. The finals of the college track will be held at the end of December, let us look forward to it!
2020 China Core Application Innovation Design Competition Award List
This China Chip Innovation Application Design Competition focuses on new infrastructure and exploring new opportunities, with five major directions: Internet of Things, artificial intelligence, information and security, medical electronics, and smart terminals. Since its launch in March, more than 300 projects across the country have signed up for the competition. A large number of outstanding Chinese core application innovation projects have emerged through the competition. They have combined China Core and started from application innovation to design a large number of distinctive Chinese core projects. In the end, 41 projects stood out, and three finals were held on November 26, 2020. After a wonderful project roadshow and expert scoring, multiple winners were finally selected and awarded at this summit forum. The following is the list of winners of this competition:
Special Prize
Intelligent EEG-controlled rehabilitation robot—Beijing Zhixing Wujiang
first prize
Nationally produced NVMeSSD solution—Beijing Yixin Technology
Advantech ROM-5780-SMARC core module - Advantech Technology
Second Prize
Infrared thermopile temperature measurement chip——Chuangxin Haiwei
High-precision 3D depth camera——Ningbo Xitang
AI dynamic vision intelligent terminal and operation platform—China Electronics Industrial Internet
Machine vision charging pile research and development and industrial application - Yidian Innovation
third prize
Connecting life in one flash - FlashEasy Technology
Small domestic PLC system for industrial Internet of Things - China Electronics Intelligence
Millimeter wave radar home monitoring series——Yunfan Ruida
Human face detection and tracking algorithm based on self-developed AI chip - Fangxin Technology
Fully integrated Doppler weather radar signal processing system based on domestic DSP - Chengdu Zhongdian Jinjiang
LaKi ultra-low power real-time wide area network technology - Qianmi Electronics
Excellent Project Award
Graphene smart defogging light mirror - OnePlus Technology
Wearable remote monitoring system—Shanghai Shiyuan Medical
Intelligent FOC motor drive——Taizhao Intelligent Control
Face recognition lock module——Fuge Technology
Application of light-sensing technology——Fumaos Technology
Smart home center based on 5G and Wi-Fi6 - Qiming Cloud
Operation and maintenance of IoT gateway——LazyYi Technology
Advantech EPC-R4710-Industrial Edge Intelligent Gateway—Advantech Technology
Blockchain IoT single chip——Hanshunlian Electronics
Smart Baby Guard Cradle——CRRC Times Semiconductor
Cross-platform embedded software development system—Qiming Cloud
Nenglian STAR routing protocol and system - Nenglian Technology
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