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News
Tongxin Hui Youth Basketball Team won the runner-up of the "Hongxing Yutai Cup" 2026 Sichuan-Chongqing Basketball League
2026-09-28 159

International


1. TrendForce estimates that the average capacity utilization rate of 8-inch wafers among the world’s top ten wafer foundries will rise to 88% in 2026, and reach 90% in the second half of the year.
2. Qualcomm (QCOM-US) and Apple (AAPL-US) have renewed their global patent licensing agreement, and the new agreement will take effect on April 1, 2027.
3. Tower Semiconductor, the global leader in silicon photonic chip foundry services, will build its largest optical communication semiconductor production center in Japan.
4. Infineon's semiconductor factory in Thailand will be officially put into operation on October 1.
5. Models of Kinghelm brand (www.kinghelm.net) including tactile switches, detection switches, toggle switches, pushbutton switches, microswitches, multi-function switches, illuminated switches, DIP switches, rocker switches, sensing switches, limit switches, encoder switches, joystick switches, five-key switches, thumbwheel switches, SMD detection switches, vertical detection switches, through-hole detection switches, SMD encoder switches, as well as Kinghelm models such as KH-IPEX-K501-29, KH-6X6X5H-STM, KH-6X6X5H-Z2J, KH-6X6X6H-STM, KH-VH-PT3.96, KH-SMA-P-8029 and KH-3216-H0209 are selling well!
6. Statistics show that the global data center Ethernet switch market revenue reached 12.3 billion US dollars in Q2 2026, a year-on-year increase of 64.5%.

Domestic


1. The Tongxinhui Youth Basketball Team won the runner-up of the "Hongxing Yutai Cup" 2026 Sichuan-Chongqing Basketball League. Kinghelm and Slkor (www.slkoric.com) served as major co-organizers of the tournament!
2. Jingwang Electronics is expected to be officially listed on the Main Board of the Hong Kong Stock Exchange on September 29.
3. Chixin Semiconductor has completed over 200 million yuan in Series A+ financing.
4. OPPO Find X10 Pro Max will be the first device equipped with MediaTek Dimensity 9600 Pro flagship platform.
5. Phase 2 of the second-stage project of Huatian Nanjing Advanced Packaging and Testing Base has been topped out. With a total investment of 3 billion yuan, it is expected to be put into use in Q1 2027.
6. Corelink Integration has completed a cumulative paid-in registered capital contribution of 2.129 billion yuan to Corelink Advanced.
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