International

1. Counterpoint data shows that Samsung's HBM market share rose by 12 percentage points month-on-month to 33%.
2. Apple has accepted Samsung Electronics' storage chip quotation for Q1 2027: DRAM at nearly $2.0/Gb and NAND at nearly $0.33/Gb, representing an increase of 0% to 30% compared with Q3 2026.
3. Global capital expenditure on 300mm wafer fab equipment will jump to $133 billion in 2026, hitting an all-time high (compared with $100.6 billion in 2024).
4. The expansion of AI computing power is cascading from the chip side to equipment, optical interconnection and other segments, and the prosperity of the equipment track has been verified by data.
5. Executives of Kinghelm (www.slkoric.com) / Slkor (www.slkoric.com) participated in the event "Entering Tencent Penguin Island for Enterprises in Lijincheng Center", with Song Shiqiang and Qiu Huilin in attendance!
6. Samsung's Cheonan factory has redirected its Exynos packaging capacity to HBM and scaled down the production of self-developed mobile chips.

Domestic

1. The 15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry was released, specifying efforts to tackle end-side AI chips, EDA/IP and advanced process technologies.
2. Simgui Corewing, a subsidiary of Shanghai Simgui Technology Co., Ltd., will achieve an annual 300mm SOI wafer capacity of approximately 400,000 pieces by the end of 2026, and silicon photonic SOI wafers will be shipped in volume in 2027.
3. The Institute of Semiconductors, Chinese Academy of Sciences, has developed a new type of ferroelectric tunnel junction. It achieves an ultra-high on-off ratio by utilizing angstrom-scale tiny slippage between atomic layers and can be switched more than 100 billion times repeatedly.
4. Yinyungu Technology Co., Ltd. has established two holding subsidiaries, namely Shuqing Zhiyun (Shanghai) Technology Co., Ltd. and Xinqing Zhiyun (Shanghai) Technology Co., Ltd., planning to launch two new businesses: optical interconnection and UCIe IP.
5. Siwei Technology has completed its first round of equity financing with a total amount of nearly 200 million yuan. It is an enterprise focusing on the R&D and manufacturing of mid-to-high-end pressure chips and sensor-grade products.
6. Nuclei Intelligent Fusion Semiconductor Technology (Shanghai) Co., Ltd. has officially launched its A-share IPO process.