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Huawei Hubble invests in another silicon carbide company
2022-03-17 247

Tianyancha App shows that Dongguan Tianyu Semiconductor Technology Co., Ltd. has recently undergone industrial and commercial changes, adding new shareholders such as Huawei-affiliated investment institution Shenzhen Hubble Technology Investment Partnership (Limited Partnership); the registered capital increased from approximately 90.27 million to approximately 97.7 million, an increase of more than 8%.

 

 

According to information on Tianyu’s official website, Tianyu (TYSiC) was established in 2009. It is China's first private enterprise engaged in the marketing, R&D and manufacturing of silicon carbide (SiC) epitaxial wafers. In 2010, Tianyu cooperated with the Institute of Semiconductors of the Chinese Academy of Sciences to jointly create the Silicon Carbide Research Institute, which is composed of the best talents in the field. Tianyu is the first company in China's silicon carbide semiconductor material supply chain to obtain automotive quality certification (IATF 16949). Currently, Tianyu has the largest number of silicon carbide epitaxial furnaces-CVD in China. Monthly production capacity is 5,000 pieces. With the most advanced epitaxial capabilities and the most advanced testing and characterization equipment, Tianyu provides global customers with n-type and p-type doped epitaxial materials, manufacturing Schottky diodes, JFETs, BJTs, MOSFETs, GTOs and IGBTs, etc.

Previously, Huawei Hubble had invested in silicon carbide company Tianke Heda. Tianke Heda is the fourth largest silicon carbide wafer manufacturer in the world and the first in my country. It has now achieved batch supply of 6-inch silicon carbide wafers. Currently, the Shanghai Stock Exchange has accepted Beijing Tianke Heda’s IPO application.

The third generation semiconductor material represented by silicon carbide (SiC) is the most promising semiconductor material after silicon. Third-generation semiconductor materials are an important part of my country's "new infrastructure" strategy and are expected to trigger technological changes and reshape the international semiconductor industry landscape.





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