International

1. Silicon-Valley-based a16z has raised USD 1.1 billion for its “Machine Age” fund, which will focus on investments in AI processors, memory chips, data storage and other sectors.
2. Sumitomo Chemical of Japan has established a mass-production system for 4-inch indium phosphide epitaxial wafers at its Ibaraki plant and officially launched product sales.
3. Sources indicate that Panasonic Industrial Solutions will raise prices for its full-range substrate materials effective September 1st, with increases ranging from 15% to 30%.
4. Kioxia will invest 1 trillion yen to build its third factory in Kitakami, Japan, mainly for manufacturing its high-density 3D NAND Flash chips.
5. NVIDIA’s H200 chip re-enters the Chinese market, contributing less than 1% to its total data-center revenue of USD 89 billion.
6. Samsung Electronics will deploy 1,612 major new Korean-manufactured production equipment units at its semiconductor back-end processing factory under construction in Thái Nguyên Province, Vietnam.

Domestic

1. Advanced thin-film equipment from Advanced Micro-Fab (AMF) has surpassed 500 cumulative reactor shipments, covering core models such as low-pressure chemical vapor deposition and metal thin-film deposition.
2. BYD’s new-generation 4D millimeter-wave radar chip with satellite-supported architecture has entered mass-production phase.
3. On August 30, 2026, Dajiayuan Procurement Network successfully held an electronics-industry summit themed “A Decade of Co-Core, Intelligent Chain for Fertile Land”. Representatives from Kinghelm / Slkor Semiconductor  attended the event.
4. Another price-hike wave hits electronic fabrics. Jushi China has officially lifted September prices for electronic fabrics, with heavy-weight fabrics up 15% and thin-weight fabrics rising by 20%.
5. Hygon Information’s invention patent ZL202011542637.5 Method for Loading and Running Virtual Trusted Environment, Data Processing and Security Processing Device has won China Patent Gold Award.
6. SHRINK Semitech has released 3.3× mask-based silicon 2.5D packaging technology, solving industry challenges for large-size chip integration.