Description

Features

1. Rated reverse working voltage of 24V, matching 24V bus and signal circuits
2. Ultra-low typical junction capacitance of 0.6pF, effectively preserving high-speed signal integrity
3. Nanoampere-level low leakage current to reduce standby power consumption
4. Full compliance with multiple international EMC standards:
   • IEC 61000-4-2 ESD: ±30kV air discharge, ±30kV contact discharge
   • IEC 61000-4-5 Lightning surge: 8A peak pulse current under 8/20μs waveform
   • IEC 61000-4-4 EFT: 40A transient pulse (5/50ns)
5. High peak pulse power up to 400W under 8/20μs surge condition
6. Bidirectional design to suppress both positive and negative transient voltage spikes
7. Nanosecond-level fast response time to instantaneously dissipate surge energy
8. Mini lead-free SOD-323 surface-mount package to save valuable PCB space
9. Complete standard lead-free reflow soldering profile for mass SMT production
10. Wide operating junction temperature range: -40℃ ~ +125℃ for diversified working environments
11. RoHS-compliant lead-free flame retardant plastic encapsulation for global green electronics export

Our advantages

1. Compact SOD-323 tiny outline fits slim smartphones, wearable devices and compact wireless sensor modules with limited PCB area
2. Ultra-low capacitance eliminates signal distortion for Gigabit Ethernet, high-speed differential data lines
3. Industry-leading ±30kV ESD withstand capacity easily passes strict consumer and industrial EMC certification
4. Single bidirectional TVS replaces two unidirectional discrete diodes, cutting BOM count and simplifying PCB routing
5. Nanoampere leakage minimizes static power loss, perfect for battery-powered wireless devices
6. 8A lightning surge resistance effectively suppresses transient interference on long-distance communication cables
7. Two-stage stable clamping voltage under different surge currents provides reliable protection for sensitive IC chips
8. Optimized low capacitance performance under rated 24V bias voltage
9. Standard lead-free reflow curve without complex temperature control for high-volume manufacturing
10. Uniform tape & reel packaging compatible with all mainstream high-speed SMT pick-and-place equipment

Mechanical Data

1. Package Type: Lead-free molded plastic SOD-323 surface-mount package
2. Outline Dimensions: Standard SOD-323 dimensional specifications (unit: mm) specified in the datasheet
3. Special dedicated PCB soldering footprint for SOD-323 layout design
4. Soldering Limit: Maximum lead temperature 260℃ within 10 seconds
5. Operating Junction Temperature: -40℃ ~ +125℃
6. Storage Temperature Range: -55℃ ~ +150℃
7. Encapsulation Material: RoHS compliant flame retardant lead-free plastic compound
8. Complete standard lead-free reflow soldering temperature profile provided

Applications

• All types of high-speed digital data transmission lines
• Smartphones and wearable portable electronic devices
• USB signal and power interface ports
• Wireless communication modules, Bluetooth and Wi-Fi RF circuits
• 10/100/1000 Base-T Gigabit Ethernet communication ports
• Industrial wired communication equipment with 24V bus voltage
• Handheld measuring instruments and low-voltage control boards
• Miniature IoT wireless sensor equipment and communication terminals