According to a survey by research firm TrendForce, the growth momentum of third-generation semiconductors is expected to rebound rapidly this year, driven by automotive, industrial, and communications needs. GaN power components will have the most obvious growth, with its market size expected to reach US$61 million this year, with an annual growth rate of 90.6%. From 2018 to 2020, the third-generation semiconductor industry was successively affected by Sino-US trade frictions, the epidemic, etc., and the overall market growth momentum was insufficient. However, TrendForce expects that first of all, the epidemic will slow down after the advent of the vaccine, which will drive the demand for components required for industrial energy conversion, such as inverters, frequency converters, etc., and communication base stations to stabilize; secondly, as Tesla Model 3 electric vehicle inverters gradually switch to SiC component manufacturing processes, third-generation semiconductors will gradually receive more attention in the automotive market. Third, in order to enhance the autonomy of semiconductors, the Chinese government has proposed the 14th Five-Year Plan this year and invested huge amounts of RMB to expand production capacity. These three major factors will become the driving force for the rapid growth of third-generation semiconductors such as GaN and SiC this year. Observing various third-generation semiconductor components, GaN components currently have some wafer manufacturing foundries such as TSMC (2330-TW), World Advanced Technology (5347-TW), etc., trying to introduce 8-inch wafer production, but the current main force is still 6-inch. TrendForce estimates that as the epidemic slows down, demand for 5G base station radio frequency front-ends, mobile phone chargers, and vehicle energy transmission will gradually increase. GaN communication and power component revenue is expected to reach US$680 million and US$61 million respectively this year, an annual increase of 30.8% and 90.6%. ​ Among them, the main driving force for the growth of GaN power components comes from mobile phone brands such as Xiaomi, OPPO, and Vivo taking the lead in launching fast charging, and laptop manufacturers are also interested in following suit. TrendForce predicts that GaN components will continue to penetrate into mobile phone and laptop accessories, and the annual growth rate will reach its peak in 2022. Subsequently, as manufacturers gradually adopt more and more popular devices, the growth momentum will slow down slightly.    

As for SiC components, since the substrate is required in both communication and power fields, the supply of 6-inch wafers is tight. It is estimated that SiC component revenue in the power field will reach US$680 million this year, an annual increase of 32%. At present, major substrate manufacturers such as CREE, II-VI, STMicroelectronics, etc. have successively launched 8-inch substrate development plans, but it will still be after 2022 that the supply difficulties are expected to be gradually alleviated.

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