Descrizione

Caratteristiche

1. Standard unidirectional single-line transient overvoltage protection design
2. High peak pulse power rating: 200W under 10/1000μs pulse waveform; up to 1000W under 8/10μs pulse
3. Low incremental surge resistance for excellent low clamping voltage performance
4. High DC power dissipation of 385mW at 25℃ ambient temperature, with clear power derating specification above 25℃
5. Standard SOD-123FL low-profile thin package, compatible with automatic SMT assembly
6. High-temperature soldering tolerance: withstand 260℃ terminal temperature for 10 seconds
7. Wide operating junction & storage temperature range: -55℃ ~ +150℃
8. Clear thermal resistance parameters (Junction-to-Ambient & Junction-to-Lead) for thermal design reference
9. Marked color band on package to identify cathode polarity for easy PCB layout recognition
10. RoHS compliant molded plastic encapsulation, lightweight and suitable for mass tape & reel packaging
11. Complete standard pulse waveform curves and capacitance characteristic curves provided for circuit simulation

I nostri vantaggi

1. Ultra-thin SOD-123FL low-profile outline saves PCB height space, ideal for slim portable devices
2. Dual pulse power ratings (10/1000μs & 8/10μs) cover lightning surge and long pulse interference scenarios
3. Low surge resistance effectively suppresses residual clamping voltage to prevent IC chip breakdown
4. Complete thermal resistance and power derating data support reliable high-temperature product design
5. Clear polarity marking avoids reverse installation errors during SMT production
6. Wide temperature range ensures stable protection performance for outdoor and high-temperature industrial equipment
7. High soldering temperature resistance adapts to standard lead-free reflow soldering processes
8. Lightweight miniature chip reduces overall product weight for handheld wearable electronics
9. Complete characteristic curve data simplifies circuit simulation and EMC verification design
10. Standard surface-mount packaging compatible with all mainstream high-speed SMT pick-and-place machines

Dati meccanici

1. Package Type: JEDEC standard SOD-123FL molded plastic surface-mount package
2. Polarity Identification: Color band marks cathode terminal
3. Mounting Mode: Can be mounted in any direction on PCB
4. Package Weight: 0.02 gram (0.006 ounces)
5. Dimensioni esterne (Unità: mm):
   • A: 3.58 (Min) ~ 3.72 (Max), Typ 3.65
   • B: 2.72 ~ 2.78, Typ 2.75
   • C: 1.77 ~ 1.83, Typ 1.80
   • D: 1.02 ~ 1.08, Typ 1.05
   • E: 0.097 ~ 1.03, Typ 1.00
   • H: 0.13 ~ 0.17, Typ 0.15
   • L: 0.53 ~ 0.57, Typ 0.55
6. Soldering Limit: Max terminal temperature 260℃ within 10 seconds
7. Operating & Storage Temperature Range: -55℃ ~ +150℃
8. Encapsulation Material: Passivated silicon chip covered with flame retardant molded plastic

Applicazioni

• Consumer portable electronics: power management circuits of mobile phones, tablets, wearables
• Notebook, desktop PC and peripheral signal & power interface circuits
• Industrial control boards, sensors and low-voltage power supply lines
• Communication equipment, router, switch signal transmission interfaces
• Audio & video devices, set-top boxes, display driving circuits
• Battery-powered handheld measuring instruments
• All surface-mount electronic products requiring unidirectional surge protection
• Automotive low-voltage auxiliary signal circuits (within operating temperature range)