International

1. Robert Bosch of Germany will set up a dedicated semiconductor division to seize opportunities brought by surging chip demand in sectors such as data centers and humanoid robots.
2. Tower Semiconductor, a foundry of high-value analog semiconductor solutions, and Innolight, a provider of optical interconnection solutions, will continue their cooperation in the emerging Near-Package Optics (NPO) field.
3. Since its launch in October 2026, Apple’s foldable iPhone Duo has received a flood of complaints over screen issues, with the faults traced to the mechanical core of the foldable device: the hinge.
4. The European Union will invest 525 million euros to help chip startups scale up faster.
5. Kinghelm (www.kinghelm.net) non-standard customized antenna connectors adopt a variety of high-performance materials including copper alloy, stainless steel and titanium alloy. These materials feature not only good electrical conductivity and mechanical strength, but also excellent corrosion resistance and high-temperature resistance, enabling them to operate in a wide range of harsh working environments.
6. Toshiba’s shareholding ratio in Kioxia, Japan’s NAND Flash manufacturer, has fallen below 11%.

Domestic

1. The 2026 APEC CEO Summit will be held in Shenzhen from November 17 to 18.
2. Oracle (ORCL.US) has cancelled a five-year AI chip leasing agreement worth approximately 7 billion US dollars (46.689 billion RMB) signed with Tencent Holdings (00700.HK).
3. In the first three quarters of 2026, BPS achieved operating revenue of 2.458 billion yuan, a year-on-year increase of 120.02%; net profit attributable to parent company was 251 million yuan, a year-on-year increase of 977.18%; non-recurring net profit was 211 million yuan, a year-on-year increase of 1437.38%.
4. The 9th China International Import Expo 2026 will be held at the National Exhibition and Convention Center (Shanghai) from November 5 to 10.
5. ST Infinova will transfer 100% equity of Xinpu Interconnection (Beijing) Technology Co., Ltd. and 100% equity of Infinova (Hangzhou) Information System Technology Co., Ltd. in a bundled transaction at a total consideration of 1.00 yuan.
6. Beijing Huixi Technology Co., Ltd., a developer of high-computing-power chips for embodied intelligence, has officially launched its A-share IPO process.