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Shenzhen Releases the 2026 APEC Theme Song Meet You in the City of Miracles (Kinghelm November 2 Chip News)
2026-11-02
112

Jinhangbiao International official website has seen a sharp surge in traffic!
International
1. Murata Manufacturing of Japan will invest 1 trillion yen (6.3 billion US dollars) within five years to meet the growing demand for cutting-edge electronic components for AI servers and devices.2. The Greek government has launched a public consultation on a proposed national strategy for semiconductors and microelectronics, with a deadline of November 12.
3. Global shipments of smartphone SoC chips plummeted 21% year-on-year in Q3 2026, with the mid-to-low-end market hit hardest.
4. Samsung is accelerating efforts to expand the market share of its self-developed Exynos chips.
5. The international version of Kinghelm’s official website (www.kinghelm.net) has completed a comprehensive upgrade. Song Shiqiang stated that he will continue to drive the global development of the kinghelme brand!
6. OpenAI is seeking to raise up to 20 billion US dollars in a new round of financing.
Domestic
1. At 11:18 on November 1, Shenzhen, the host city of APEC China 2026, released the theme song Meet You in the City of Miracles, with its eponymous MV launched worldwide simultaneously.2. The AMD EMBEDDED SUMMIT will be held at Hilton Shenzhen Shekou Nanhai Hotel in Nanshan District, Shenzhen on December 1, 2026.
3. Xinxin Hangtu is researching a next-generation computing chip with a computing power of up to 3000 TOPS.
4. Xpeedic released EDA 2027, adding a 3DIC PDK and optoelectronic co-simulation platform, and launching the AgentEvo agent platform and Physics AI trusted physical intelligence.
5. The first phase of the industrialization project for high-end optoelectronic and silicon photonic chip devices of Accelink Technology has started construction, with a total investment of 10.2 billion yuan.
6. ChangXin Memory Technologies is expected to launch a new generation of DDR5 RDIMM server memory integrating the 4F² architecture and hybrid bonding technology by the end of 2026.
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