summary

ASPENCORE's "Electronic Engineering Special" analyst team selected 30 domestic power management chip and power semiconductor manufacturers through first-hand tracking surveys and analysis, plus each company's official website information and public data, and conducted appropriate quantitative assessments and comprehensive strength statements for them. This is another heavyweight report in the China Fabless 100 series of industry analysis. I believe it will give readers a more comprehensive and in-depth understanding of the current status and future development trends of China's power semiconductor market and local manufacturers.

 

This report is divided into nine parts as follows:

1. Introduction to power management chips and power semiconductor devices

2. Global power management chip (PMIC) market size and major manufacturers

3. Domestic power management chip (PMIC) market size and major manufacturers

4. Wireless charging/fast charging market segments and major domestic manufacturers

5. Global power semiconductor market size and major manufacturers

6. Domestic power semiconductor market size and major manufacturers

7. Wide bandgap semiconductor market and major domestic manufacturers

8. Basic information of 30 domestic power management chip and power semiconductor manufacturers

9. Attached: Comparison of the comprehensive strength of 30 domestic power management chip and power semiconductor manufacturers

 

1. Introduction to power management chips and power semiconductor devices

 

Power management and power (POWER) devices are the basis of all electronic products and equipment. From high-voltage transmission, AC-DC conversion, DC-DC conversion, to linear voltage regulation and voltage stabilization output, various power discrete devices, integrated circuits and modules are required to work stably.

 

 

Power devices can be divided into power management integrated circuits and discrete power semiconductor devices. The former includes AC-DC, DC-DC conversion, LDO, battery management IC, charging chip and switch IC, etc.; the latter includes rectifier diodes, thyristors, MOSFETs and IGBTs, etc.

 

The power management chip is an integrated power management device. Its main functions are voltage stabilization, step-up and step-down, constant current, AC-DC conversion, etc. It is divided into linear voltage regulator (LDO), charge pump (Charger-pump) chip, DC-DC converter, AC-DC converter, LED driver chip, etc. Its typical applications include chargers, LED drivers for consumer electronics such as mobile phones and laptops, and power management of battery-powered equipment. In addition, industrial automation equipment, smart meters and other industrial applications are also the main application markets for power management chips.

 

Among power semiconductor devices, MOSFET devices working in the power output stage are usually used as standard devices with driver circuits, and are very popular in the fields of consumer electronics and automotive electronics. IGBT (Insulated Gate Bipolar Transistor) is very suitable for converter systems with DC voltages of 600V and above, such as AC motors, frequency converters, switching power supplies, lighting circuits, traction drives, etc. Discrete devices such as rectifier diodes, Zener diodes, and thyristors are also widely used in 5G, aerospace, power electronics, consumer electronics, security, industrial control, automotive electronics, green lighting, new energy and other fields.

 

In addition, the development of wireless charging technology and the market demand for fast charging of mobile phones have also driven the rapid growth of the market for wireless charging transceiver devices and power management chips compatible with various fast charging protocols. As the process technology of wide bandgap semiconductor devices matures and manufacturing costs decrease, third-generation semiconductor devices based on gallium nitride (GaN) and silicon carbide (SiC) have also begun to enter the mainstream market and are likely to gradually replace traditional silicon-based semiconductor devices.

 
2. Global power management chip (PMIC) market size and major manufacturers

According to statistics and forecasts from the Qianzhan Industry Research Institute, the global power management chip market has grown from US$19.1 billion in 2015 to US$25 billion in 2018. It will still maintain rapid growth in 2019, with the Asia-Pacific region, dominated by mainland China, being the largest growth regional market in the future. The global market size is expected to reach US$56.5 billion by 2026, with a compound annual growth rate (CAGR) of 10.69% during 2018-2026.

Data source: Qianzhan Industry Research Institute

 

As battery-powered equipment and society and the market have increasingly higher requirements for energy conservation and environmental protection, the power management of electronic equipment tends to be refined and differentiated. Power management chips have become the key to improving overall machine performance and differentiated competition. Chips are constantly developing towards high performance and miniaturization, and the circuit density inside the chip continues to increase. During the power supply process, the electric field intensity endured by the circuit inside the chip increases linearly with the decrease in distance. Taking the conventional 5V power supply voltage as an example, the electric field strength is enough to breakdown the chip. Therefore, electronic systems require power management chips with voltage reduction, voltage stabilization and anti-interference performance.

 

Popular applications such as wireless communications, consumer electronics, IoT devices, 5G and new energy electric vehicles all have strong demand for power management and power devices, but they also put forward higher requirements. Power management devices and modules must not only achieve smaller size and higher power density, comply with EMI radiation and safety isolation standards, but also achieve low quiescent current, low noise and high-precision performance. Specific to product categories, 5G mobile phones, 5G base stations, TWS wireless headsets, wireless/fast chargers, battery-powered IoT devices, as well as electric vehicles and charging piles will be the main driving force for power management devices.

 

According to statistics from Yole, it is expected that the share of mobile communications and consumer electronics applications in the global power management chip market will drop from 51.4% to 48.8% between 2018 and 2024, but it will still be the largest market segment for power management chips. In addition, industry and computers are also the main application segments of power management chips.

 

Although the largest end market for power management chips is still mobile phones and consumer electronics products, due to fierce price competition for such products, chip manufacturers' profits are also relatively low. In the field of automotive and industrial power supply IC market applications, due to high application technology requirements and high product gross profit margins, most foreign manufacturers focus on the automotive and industrial power supply fields with higher thresholds. For example, more than half of ADI's revenue comes from the automotive and industrial sectors. Overall, in the future, the transformation of power management chip application fields from the low-end consumer electronics market to the high-end industrial and automotive markets will become a new trend in industry development.

 

At present, the global power management chip market is mainly monopolized by international giant companies. Judging from the market share in 2018, the five manufacturers TI, Qualcomm, ADI, Maxim and Infineon accounted for 71%. In addition, international manufacturers such as NXP, MPS, ON Semiconductor and Diodes also have strong technical and market strength. Domestic power management chip manufacturers are relatively weak and scattered, and their overall strength is still relatively weak.

 

3. Domestic power management chip market and major manufacturers

 

According to statistics from CCID Consulting, from 2012 to 2018, the domestic power management chip market grew from 43.068 billion yuan to 68.153 billion yuan, with a compound annual growth rate of 7.95%. The industry as a whole maintains a steady growth trend.

Data source: CCID Consulting

In the domestic power management chip market, overseas manufacturers such as TI, MPS, and PI account for about 80% of the market share. Among them, competition in the consumer electronics market is extremely fierce, and domestic power management IC manufacturers are rapidly rising in this market. Overseas manufacturers have a tendency to gradually fade out of the consumer market and turn to high-performance, high-profit markets such as automotive grade, industrial grade, military grade and aerospace grade.

Among local power management IC manufacturers, companies such as Shengbang Micro, Xinpeng Micro, Silan Micro, Silan Micro, Shanghai Belling/Nanjing Weimeng, and Xinzhihui have leading advantages in the domestic market, especially Silan Micro, Shengbang Micro, and Xinpeng Micro. In 2018, their power management chip sales reached 663 million yuan, 340 million yuan, and 312 million yuan respectively.

 

The market share of local power management chip manufacturers in 2018 is as follows:

 

Among the seven major sectors of new infrastructure, 5G, artificial intelligence and big data centers are to achieve "digital industrialization", while new energy vehicles, intercity expressways, ultra-high voltage and industrial Internet of Things are to achieve "industrial digitalization". Both traditional industries and emerging digital industries are inseparable from basic elements such as power supply and semiconductors. Power semiconductors used for power transmission, conversion and management will undoubtedly be the most fundamental driving force for new infrastructure. The trend of new infrastructure and "domestic substitution" will create huge development space and opportunities for local power management chip manufacturers.

 

4. Wireless charging/fast charging market segments and major domestic manufacturers

 

In recent years, fast charging and wireless charging driven by global mainstream smart terminal manufacturers such as Apple, Huawei, Samsung and OPPO have been favored by consumers. Since every smartphone or laptop comes with at least one or more power adapters or chargers as standard, the huge number of terminal applications is expected to significantly increase the market demand for power management chips.

 

The rich charging voltage and current configurations of USB PD fast charging technology enable various electronic devices to meet the power supply needs through a USB cable. It can not only power mobile devices, but also directly power notebooks and monitors, and can achieve two-way charging. In view of the high popularity of USB interfaces in the electronic product market, USB PD fast charging has broad application prospects.

 

In addition, the application of gallium nitride (GaN) devices is also promoting the continuous upgrading of fast charging technology. The switching performance of GaN transistors is better than that of traditional silicon-based MOSFETs, allowing higher switching frequencies to be achieved, thereby improving power density and transient performance while maintaining reasonable switching losses. Due to its higher energy conversion efficiency, GaN fast charging has lower power consumption and reduced heat generation, so it can realize the design of smaller charger products and is expected to become an important direction for fast charging upgrades.

 

In the wireless charging and fast charging charger market, many local chip manufacturers are already participating in the competition, including Yichong Wireless, Yingjixin and Zhonghui Chuangzhi. In the gallium nitride fast-charging charger market, chip manufacturers such as Zhuhai Innosec and Suzhou Liangwei Semiconductor have also begun mass production and shipment.

 

5. Global power semiconductor market size and major manufacturers

 

Power ICs, IGBTs, MOSFETs and power diodes are the four most widely used power semiconductor products. According to the analysis of authoritative market research institutions, in the global power semiconductor market in 2017, power IC accounted for 54% and was the power semiconductor product with the largest market share. Power IC integrates components such as transistors, diodes, resistors and capacitors on a semiconductor chip with the required circuit functions. Depending on the application, power ICs include AC-DC conversion, DC-DC conversion, power management and driver ICs, etc.

 

IGBT accounts for 17%. Since IGBT has a wide operating frequency range and can cover a higher power range, it is widely used in railway transportation, photovoltaic power generation, automotive electronics and other fields; MOSFET accounts for 12% and is mainly used in uninterruptible power supplies, switching power supplies, inverters and other fields; power diodes account for 15% and is mainly used in power supplies, adapters, automobiles and consumer electronics.

According to IHS data, the global power semiconductor market size was approximately US$39.1 billion in 2018, and reached US$40.3 billion in 2019. The market size is expected to grow to US$44.1 billion in 2021, with a CAGR of 4.1% from 2018 to 2021. Among them, the Chinese market accounts for about 35%, with a market size of US$13.8 billion, a year-on-year increase of 9.5%, making it the largest single market for power semiconductors in the world.

 

The major manufacturers and market shares of the global power semiconductor market in 2019 are as follows:

At present, the global power semiconductor market is mainly monopolized by overseas manufacturers such as Infineon, TI, ON Semiconductor, and ST. my country's local manufacturers have low self-sufficiency rates in many market segments, and domestic substitution of power semiconductors is imperative.

 

6. Domestic power semiconductor market size and major manufacturers

 

Due to the impact of the global COVID-19 epidemic, the growth trend of the global power semiconductor market in 2020 has become difficult to predict. Possible expectations will be negative growth of -9.1% and the market size will reach $36.7 billion. It will grow 8.1% from 2020 to 2021 to reach $39.6 billion.

China's power semiconductor market was approximately US$14.48 billion in 2019, accounting for 35.9% of the global power semiconductor market. There will be negative growth in 2020, falling to $13.8 billion. Growth is expected to resume in 2021, with a growth rate exceeding 10%.

 

 

Although the Chinese market accounts for 1/3 of the global power semiconductor market, the proportion of local manufacturers is relatively low. Major international manufacturers such as Infineon, ST and Renesas still dominate the domestic market. But we can also see that traditional power semiconductor manufacturers such as Jilin Huawei, Yangzhou Yangjie and Suzhou Goodtech have shown strong competitiveness in the mid-to-low-end MOSFET, diode and thyristor markets. China Resources Micro, Silan Micro and BYD Semiconductor are also gradually gaining market positions in the IGBT field.

 

The following table lists some domestic power semiconductor manufacturers and their main products.

 

The technology and applications of mid-to-low-end power semiconductor products represented by MOSFETs are relatively mature, and the industry threshold is not high, which is conducive to the rapid entry of local manufacturers. As major overseas manufacturers have successively withdrawn from the mid- to low-end power semiconductor market and specialized in high-profit products in fields such as automotive electronics and new energy, the global mid-to-low-end power semiconductor industry has gradually shifted to Taiwan and mainland China. With cost advantages and location advantages closer to the local market, local power semiconductor manufacturers are expected to take the lead in making breakthroughs at the mid- to low-end of the industry chain and continue to increase market share.

 

7: Wide bandgap semiconductor market and major domestic manufacturers

 

The research and application of wide-bandgap semiconductor materials represented by gallium nitride (GaN) and silicon carbide (SiC) have a history of more than 20 years, but it is only in recent years that their commercial development prospects have begun to emerge. The radio frequency front-end of 5G communications has strict requirements for high frequency and high efficiency, which is where gallium nitride (GaN) comes in. In addition, the demand for fast and efficient charging of automobile electrification and portable electronic products will also drive gallium nitride (GaN) power devices to the mass market, gradually replacing traditional silicon power devices.

 

Gallium nitride (GaN) devices can be divided into two categories: discrete devices and integrated devices. Separate devices mainly include enhancement mode (E-Mode) GaN transistors and depletion mode (D-Mode) GaN transistors. Representative manufacturers include Panasonic, EPC, Infineon, ON Semiconductor, GaN Systems and Transphorm. Integrated devices are divided into system-level packaging integration and system-level chip integration. Representative manufacturers include TI, EPC, Infineon, Navitas, Power Integrations (PI) and dialog.

 

The main classifications and representative manufacturers of GaN devices. (Source: Yole)

 

According to Yole's market segment forecast for GaN applications, GaN will begin to grow rapidly in power applications starting in 2019, and is expected to exceed US$200 million by 2022, with fast charging chargers for mobile devices being its main driving force.

The main application market growth and scale of GaN devices are among which non-automotive power applications are growing the fastest. (Source: Yole)

Although China's third-generation semiconductor research and manufacturing started late, a number of major gallium nitride and silicon carbide projects are under construction, including Xiamen Sanan Integrated's production lines covering GaAs, GaN, SiC chips and epitaxy; China Resources Microelectronics' 8-inch gallium nitride on silicon production line; Innosec's 8-inch gallium nitride on silicon production line in Suzhou; Hangzhou Silan Microelectronics' 12-inch advanced compound semiconductor production line in Xiamen. In addition to these IDM or foundry manufacturing lines with heavy capital investment, start-up companies such as Shenzhen Basic Semiconductor and Chengdu Nitrogen Silicon Technology have also begun to join the market. It is expected that more local manufacturers will be established and grow in the emerging wide bandgap semiconductor industry in the future.

 

8. Basic information of 30 domestic power management chip and power semiconductor manufacturers

 

The ASPENCORE analyst team selected the 30 most representative companies from many domestic power management and power device manufacturers and selected them according to the following categories:

1. Power management chip: 15 companies

2. Wireless charging/fast charging devices: 5 companies

3. Power semiconductor devices: 5 companies

4. Wide bandgap semiconductor: 5 companies

 

Information statistics table of 30 domestic power management chip and power semiconductor manufacturers:

Data source: ASPENCORE

 

Among these 30 manufacturers, 12 are listed companies and two are start-ups that have been established for less than 5 years. Judging from the distribution of company headquarters locations, Shenzhen has the most with 9; Shanghai has 4; Beijing, Wuxi and Hangzhou each have 3; Suzhou and Zhuhai each have 2; Chengdu, Guangzhou, Yangzhou and Jilin each have 1.

 

9. Attachment: Comparison of the comprehensive strength of 30 domestic power management chip and power semiconductor manufacturers

 

Shengbang Shares

Core technology: low-power analog signal chain and power management technology

Main products: 16 major series of more than 1,400 models of high-performance analog IC products, including operational amplifiers, comparators, audio/video amplifiers, analog-to-digital/digital-to-analog converters, analog switches, level conversion and interface chips, small logic chips, LDOs, microprocessor power monitoring chips, DC/DC converters, backlight and flash LED drivers, OVP and load switches, motor drivers, MOSFET drivers, battery protection and charge and discharge management chips, etc.

Key applications: communication equipment, consumer electronics, industrial control, IoT smart devices, wearable devices

Main customers: Analog devices are versatile, have a wide range of applications, and have many customers.

Competitive Advantage: Complete Analog Signal Chain and Power Management Product Line

 

Silicon Lijie

Core technology: 30W isolated charge pump fast charging technology, MiniLED driver

Main products: battery management chips, DC-DC converters, overcurrent protection devices, LED drivers, PMU

Key applications: consumer electronics, industrial applications, computers, communication network equipment

Main customers: smart TV manufacturers, computer and tablet manufacturers

Competitive advantage: More than 1,200 PMIC-related patents

 

Xinpengwei

Core technology: high-voltage industrial-grade power management technology

Main products: AC-DC converters, DC-DC converters, charging management, AC-DC industrial power chips

Key applications: household appliances, standard power supplies, mobile digital, industrial drives

Major customers: Midea, Gree, Skyworth, Philips, ZTE, Huawei

Competitive advantage: high and low voltage integrated technology platform

 

Jingfeng Mingyuan

Main products: LED lighting driver chips, motor control chipsets

Core technology: intelligent lighting driver chip technology

Key applications: LED lighting, motor drives

 

Fuman Electronics

Main products: power management, LED control and driver, MOSFET, MCU, non-volatile memory, RFID, RF front-end

Core technology: Type-C PD controller, temperature control of LED lighting system

Key applications: consumer electronics, automotive electronics

 

Shanghai Belling

Main products: smart metering SoC, power management, non-volatile memory, high-speed and high-precision ADC, industrial control semiconductors

Core technology: Next-generation smart meter measurement and data converter technology for 5G communications

Key applications: electricity meters, mobile phones, LCD TVs and flat panel displays, set-top boxes

 

Angbao Electronics

Core technologies: Analog and digital-analog hybrid ICs using sub-micron CMOS, Bipolar, Bicmos, and BCD process technologies

Main products: AC/DC power management chips, lighting and backlight driver chips, MCU products

Key applications: communications, consumer electronics, computers and interface equipment

Competitive advantage: Leading manufacturer of AC/DC power management chips for computers and mobile phone chargers, with more than 300 power management related patents

 

Nanxin Semiconductor

Core technology: buck-boost technology

Main products: buck-boost power chips, charging management chips, charge pump chips, wireless charging devices

Key applications: mobile phone chargers, consumer electronics, mobile power supplies, car chargers

Main customers: Huawei, Xiaomi and other mobile phone manufacturers

Competitive advantage: Obtain the dominant position in smart terminal peripheral charging equipment

 

Jewart

Core technology: high energy efficiency battery management system

Main products: DC-DC converters, battery management systems, linear power supplies, LED lighting drivers

Key Applications: Consumer Electronics, Industrial Applications, Communications and Enterprise Computing

 

Microsource Semiconductor

Core Technology: Power Management and Battery Charging

Main products: battery charging chips, battery management system chips, overvoltage/overcurrent protection chips, boost/buck devices, LED driver chips

Key applications: battery systems, display systems, wireless communication systems and personal wearable devices, etc.

 

Shenzhen Xinzhihui

Core technology: Unique leading technologies in areas such as power metering, power consumption management, and audio codecs

Main products: power management unit, battery management unit, audio codec, interface single chip

Key applications: tablet computers, TV boxes, driving recorders, sports DVs, wireless storage devices, smart hardware, handheld payment terminals, e-books, micro projectors and other products

 

Guangzhou Jinshengyang

Core technology: research and application of system integrated packaging (Chiplet SiP) platform technology, magnetic and electrical isolation technology and products

Main products: CAN/485 isolation transceiver module, AC/DC power control chip, DC/DC power control chip, interface chip, startup chip, digital isolator, contactor power-saving control chip

Key applications: industrial control, electric power, rail transit, automotive electronics, Internet of Things, 5G, medical

Competitive advantages: More than 500 invention patents and independent research and development technology, Chiplet SiP packaging technology, providing one-stop power solutions

 

Global Semiconductor/Wuxi Broadcom Micro

Core technology: digital power management chip

Main products: 120-180V compatible DCM-CCM-QR mode synchronous rectification, 85V process SSR chip

Key applications: 5G smart terminals, consumer communications, industrial control, TV power supplies and white goods, motor-motor power supply applications, Netcom products, medical equipment power supplies

Major customers: Alibaba, Baidu, Xiaomi, Lenovo, JD.com, ZTE, Changhong, Meiling, Tencent

Emerging projects: motor-motor power management, lithium battery charging pack management

Competitive advantage: Innovator of third-generation digital power management chips, chip supplier of one-stop power solutions

 

Xinzhou Technology

Core Technology: Power Conversion and Power Control

Main products: high-voltage input buck DCDC converter, high-power boost DCDC converter, high-power power device gate driver, wireless charging transmitter PMIC

Key applications: industrial control, industrial power supply, BMS, smart tools, robots, white goods, automotive electronics, communication base stations, audio systems, wireless charging power transmission

Major customers: Invic, Stone Technology, Hemai, Midea, TCL Air Conditioning, Gree Jinghong, Huichuan, Huayang, Zhangrui, Guoguang, Beland, Lingtong

Emerging projects: automotive grade DC-DC converter

 

China Resources Microelectronics

Core technology: Focus on the fields of power semiconductors and smart sensors, providing customers with a series of semiconductor products and services

Main products: MOSFET, IGBT, power IC, smart sensor, MCU, etc.

Key applications: Power devices focus on three electrical applications: batteries, power supplies, and motors; smart sensors focus on the Internet of Things and the general health field

Main customers: In the home appliance category, there are large complete machine manufacturers such as Midea and Haier, which occupy the majority of the market share in low-speed electric vehicle motor controllers, as well as some manufacturers of small home appliances and mobile phone chargers.

Competitive advantage: A semiconductor company with integrated operation capabilities across the entire industry chain including chip design, wafer manufacturing, packaging and testing. The company has independent product design and controllable manufacturing processes. It has strong product technology and manufacturing process capabilities in the fields of discrete devices and integrated circuits, and has formed advanced characteristic processes and serialized product lines.

 

Zhonghui Chuangzhi

Core technologies: magnetic resonance wireless power supply technology, wireless power supply technology solutions for kitchen appliances

Main products: various power wireless power supply ICs and modules

Key applications: wireless charging of mobile phones, wireless power supply for robots, wireless power supply for power tools, wireless charging of electric energy vehicles

Major customers: State Grid Intelligence, Midea, Xinbao Co., Ltd., Muyuan Co., Ltd., Yijiahe

Competitive advantage: the first company to commercialize wireless power supply for kitchen appliances

 

Quantum Micro Semiconductor

Core technologies: gallium nitride power devices, gallium nitride IC, gallium nitride-based advanced power solutions

Main products: gallium nitride power devices

Key applications: USB-PD adapter, smart home, PC/server power supply, electric vehicle OBC

Major customers: BYD, Midea, Xiaomi, Freecon, Huntkey, TCL, Haineng, etc.

Competitive advantage: the most cutting-edge gallium nitride power device technology and solutions

 

Meixinsheng

Core technologies: high voltage, high current, high power analog power management and digital circuit design

Main products: wireless charging receiver chip, transmitter chip integrating USB-PD protocol, LED driver chip

Key applications: wireless chargers, mobile phone fast charging, TWS headset charging bins and other intelligent terminal equipment

Competitive advantage: Focus on the development of highly integrated power management chips and systems integrating high-performance analog power, digital and software

Easy to charge wireless

Core technology: Instant charging, no alignment required, full-plane fast charging wireless charging technology

Main products: multi-mode wireless charging receiving chips EC4016 and EC3016, multiple wireless charging transmitter solutions, wireless charging system optimization tools and coil design tools

Key applications: Wireless charging applications for electronic devices such as mobile phones and tablets

Competitive advantages: It has more than 30 core US patents for wireless charging, and has many years of engineering research and development experience in the fields of wireless charging system architecture, power electronics technology, electromagnetic compatibility design, electromagnetic radiation protection and electromagnetic safety. Cooperated with Hong Kong wireless charging technology leader Convenient Power (CP) to establish Convenient Power Systems (CPS)

 

Yingji core

Core technologies: power management, battery management, wireless signal processing and high-performance audio signal processing technologies

Main products: power management, audio processing and battery management (including mobile power SoC)

Key applications: smartphones, tablets, set-top boxes, IPC, vehicle charging and other fields

 

Xinmaowei

Core technology: sealed high-voltage synchronous rectification

Main products: AC-DC converters, high-voltage synchronous rectification devices, fast charging chips

Key applications: consumer electronics, communications, computers, robots, drones, power electronics, medical electronics, etc.

 

Jinxinwei

Core technology: reverse wireless charging solution CV8035D, supporting up to 20W reception + 10W transmission.

Main products: wireless charging transmitter and receiver chips

Key applications: Focus on emerging fields such as wireless charging, wearable devices, health care, and mobile terminals

 

BYD Semiconductor

Core technology: design, manufacturing and testing of automotive grade IGBT and SiC devices

Main products: power semiconductor devices, IGBT power modules, power management ICs, CMOS image sensors, sensing and control ICs, audio and video processing ICs, etc.

Key applications: new energy vehicles, industrial control

Main customer: BYD

Competitive advantage: The only supplier of automotive-grade IGBT devices in China, with advantages in integrating semiconductor devices and electric vehicle systems

 

Yangjie Technology

Core technology: SiC/IGBT/MOSFET/Clip packaging and wafer design and other R&D technology platforms

Main products: discrete device chips, rectifier devices, protection devices, small signal, MOSFET, power modules, silicon carbide, etc.

Key applications: power supply, home appliances, lighting, security, network communications, consumer electronics, new energy, industrial control, automotive electronics and other fields

Competitive advantage: vertically integrated (IDM) semiconductor manufacturers

 

Suzhou Good Technetium

Core technology: Focus on semiconductor rectifiers, power diodes, rectifier bridges and IC packaging testing

Main products: bridge rectifiers, diodes, polymer static suppressors, MOSFETs, automotive rectifiers, etc.

Key applications: Power management modules, consumer electronics, automotive electronics, industrial equipment, computer equipment, lighting and communications equipment

Major customers: HW, Apple, BYD, Panasonic, Flextronics, Visteon, Hella, Omron

Competitive advantages: Complete semiconductor discrete device product line, MEMS-CMOS three-dimensional integrated manufacturing platform

 

Jilin Huawei

Core technology: design of power semiconductor devices, terminal design and process control technology

Main products: fully controlled power devices based on IGBT, MOSFET, and BJT (bipolar transistor); semi-controlled power devices based on Thyristor (thyristor); uncontrollable power diode devices based on Schottky diode and FRD (fast recovery diode); IPM (power module); TVS (transient suppression diode), Zener (Zener diode), TSS (semiconductor discharge tube) and other semiconductor protection devices

Key applications: new energy vehicles, photovoltaics, frequency conversion, industrial control, consumer electronics and other fields

Competitive Advantage: Complete Power Semiconductor Wafer Production Line

 

Innosec

Core technology: R&D and production of third-generation semiconductor power electronic devices

Main products: 30V-650V gallium nitride power and 5G RF devices

Key applications: new energy vehicles, 5G communications, data centers, wireless charging and fast charging

Emerging projects: 8-inch gallium nitride on silicon production line

Competitive advantage: Built China's first 8-inch silicon-based gallium nitride epitaxial and chip mass production line

 

Shilanwei

Core technologies: The research and development of high-voltage BCD, ultra-thin trench gate IGBT, super-junction high-voltage MOSFET, high-density trench gate MOSFET, fast recovery diodes, MEMS sensors and other processes have formed a relatively complete characteristic process manufacturing platform;

Main products: power supply and power driver product line, MCU product line, digital audio and video product line, RF and mixed signal product line, discrete device product line, etc.;

Key applications: consumer electronics, industrial control, automotive electronics, home appliances;

Major customers: Global brand customers such as Huawei, Hikvision, Midea, Gree, Hisense, Haier, Samsung, Sony, Delta, Daktronics, and Japan's NEC;

Emerging projects: MEMS sensor expansion project with annual production capacity of 890 million pieces, special power module and power device packaging and testing production line project;

Competitive Advantage: Integrated Design and Manufacturing (IDM) Model for Semiconductor and Integrated Circuit Products

 

basic semiconductors

Core technology: 650V~10kV silicon carbide process technology

Main products: full current and voltage grade silicon carbide Schottky diodes, 1200V silicon carbide MOSFETs, automotive grade full silicon carbide power modules and other products; 150mm silicon carbide epitaxial wafers

Key applications: new energy, electric vehicles, smart grids, rail transit, industrial control, national defense and military industry, etc.

Competitive advantage: R&D and industrialization of silicon carbide power devices

 

Nitrogen Silicon Technology

Core technology: Domestic production level 650V enhancement mode gallium nitride MOSFET

Main products: discrete high-speed gallium nitride gate driver chip (DX1SE-A), 650V enhancement mode gallium nitride MOSFET, gallium nitride power IC (DX2SE65A150)

Key applications: mobile phone fast charging, data center, on-board charging (OBC), LED power driver and 5G communication power supply, etc.

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