服務熱線
總結
ASPENCORE's "Electronic Engineering Special" analyst team selected 30 domestic power management chip and power semiconductor manufacturers through first-hand tracking surveys and analysis, plus each company's official website information and public data, and conducted appropriate quantitative assessments and comprehensive strength statements for them. This is another heavyweight report in the China Fabless 100 series of industry analysis. I believe it will give readers a more comprehensive and in-depth understanding of the current status and future development trends of China's power semiconductor market and local manufacturers.
This report is divided into nine parts as follows:
-
電源管理晶片和功率半導體裝置簡介
-
Global power management chip (PMIC) market size and major manufacturers
-
Domestic power management chip (PMIC) market size and major manufacturers
-
無線充電/快速充電市場細分及主要國內製造商
-
Global power semiconductor market size and major manufacturers
-
Domestic power semiconductor market size and major manufacturers
-
Wide bandgap semiconductor market and major domestic manufacturers
-
Basic information of 30 domestic power management chip and power semiconductor manufacturers
-
配件:30家國內電源管理晶片和功率半導體廠商綜合實力對比
1. 電源管理晶片和功率半導體裝置簡介
電源管理和電源(POWER)裝置是所有電子產品和設備的基礎。從高壓傳輸、AC-DC轉換、DC-DC轉換,到線性電壓調節和電壓穩定輸出,都需要各種功率分立元件、積體電路和模組的穩定運作。
Power devices can be divided into power management integrated circuits and discrete power semiconductor devices. The former includes AC-DC, DC-DC conversion, LDO, battery management IC, charging chip and switch IC, etc.; the latter includes rectifier diodes, thyristors, MOSFETs and IGBTs, etc.
The power management chip is an integrated power management device. Its main functions are voltage stabilization, step-up and step-down, constant current, AC-DC conversion, etc. It is divided into linear voltage regulator (LDO), charge pump (Charger-pump) chip, DC-DC converter, AC-DC converter, LED driver chip, etc. Its typical applications include chargers, LED drivers for consumer electronics such as mobile phones and laptops, and power management of battery-powered equipment. In addition, industrial automation equipment, smart meters and other industrial applications are also the main application markets for power management chips.
Among power semiconductor devices, MOSFET devices working in the power output stage are usually used as standard devices with driver circuits, and are very popular in the fields of consumer electronics and automotive electronics. IGBT (Insulated Gate Bipolar Transistor) is very suitable for converter systems with DC voltages of 600V and above, such as AC motors, frequency converters, switching power supplies, lighting circuits, traction drives, etc. Discrete devices such as rectifier diodes, Zener diodes, and thyristors are also widely used in 5G, aerospace, power electronics, consumer electronics, security, industrial control, automotive electronics, green lighting, new energy and other fields.
In addition, the development of wireless charging technology and the market demand for fast charging of mobile phones have also driven the rapid growth of the market for wireless charging transceiver devices and power management chips compatible with various fast charging protocols. As the process technology of wide bandgap semiconductor devices matures and manufacturing costs decrease, third-generation semiconductor devices based on gallium nitride (GaN) and silicon carbide (SiC) have also begun to enter the mainstream market and are likely to gradually replace traditional silicon-based semiconductor devices.
2. 全球電源管理晶片(PMIC)市場規模及主要廠商
根據前瞻產業研究院的統計與預測,全球電源管理晶片市場規模已從2015年的19.1億美元成長至2018年的25億美元。預計2019年仍將維持快速成長,其中以中國大陸為主導的亞太地區將成為未來成長最快的區域市場。全球市場規模預計2026年將達到56.5億美元,2018年至2026年的複合年增長率(CAGR)為10.69%。
Data source: Qianzhan Industry Research Institute
隨著電池供電設備的普及以及社會和市場對節能環保要求的日益提高,電子設備的電源管理趨於精細化和差異化。電源管理晶片已成為提升整機效能和實現差異化競爭的關鍵。晶片不斷朝著高性能和小型化方向發展,晶片內部電路密度持續增加。在供電過程中,晶片內部電路所承受的電場強度隨距離的減少而線性增加。以傳統5V的供電電壓為例,其電場強度足以擊穿晶片。因此,電子系統需要具備降壓、穩壓和抗干擾性能的電源管理晶片。
無線通訊、消費性電子、物聯網設備、5G和新能源電動車等熱門應用對電源管理和電源裝置的需求旺盛,同時也提出了更高的要求。電源管理元件和模組不僅要實現更小的尺寸和更高的功率密度,符合電磁幹擾輻射和安全隔離標準,還要具備低靜態電流、低雜訊和高精度等性能。具體到產品類別,5G手機、5G基地台、TWS無線耳機、無線/快充、電池供電的物聯網設備以及電動車和充電樁將成為電源管理裝置的主要驅動力。
根據Yole的統計數據,預計2018年至2024年間,行動通訊和消費性電子應用在全球電源管理晶片市場中的份額將從51.4%下降至48.8%,但仍將是電源管理晶片最大的市場細分領域。此外,工業和電腦也是電源管理晶片的主要應用領域。
Although the largest end market for power management chips is still mobile phones and consumer electronics products, due to fierce price competition for such products, chip manufacturers' profits are also relatively low. In the field of automotive and industrial power supply IC market applications, due to high application technology requirements and high product gross profit margins, most foreign manufacturers focus on the automotive and industrial power supply fields with higher thresholds. For example, more than half of ADI's revenue comes from the automotive and industrial sectors. Overall, in the future, the transformation of power management chip application fields from the low-end consumer electronics market to the high-end industrial and automotive markets will become a new trend in industry development.
At present, the global power management chip market is mainly monopolized by international giant companies. Judging from the market share in 2018, the five manufacturers TI, Qualcomm, ADI, Maxim and Infineon accounted for 71%. In addition, international manufacturers such as NXP, MPS, ON Semiconductor and Diodes also have strong technical and market strength. Domestic power management chip manufacturers are relatively weak and scattered, and their overall strength is still relatively weak.
3. 國內電源管理晶片市場及主要廠商
According to statistics from CCID Consulting, from 2012 to 2018, the domestic power management chip market grew from 43.068 billion yuan to 68.153 billion yuan, with a compound annual growth rate of 7.95%. The industry as a whole maintains a steady growth trend.
資料來源:CCID顧問公司
In the domestic power management chip market, overseas manufacturers such as TI, MPS, and PI account for about 80% of the market share. Among them, competition in the consumer electronics market is extremely fierce, and domestic power management IC manufacturers are rapidly rising in this market. Overseas manufacturers have a tendency to gradually fade out of the consumer market and turn to high-performance, high-profit markets such as automotive grade, industrial grade, military grade and aerospace grade.
Among local power management IC manufacturers, companies such as Shengbang Micro, Xinpeng Micro, Silan Micro, Silan Micro, Shanghai Belling/Nanjing Weimeng, and Xinzhihui have leading advantages in the domestic market, especially Silan Micro, Shengbang Micro, and Xinpeng Micro. In 2018, their power management chip sales reached 663 million yuan, 340 million yuan, and 312 million yuan respectively.
The market share of local power management chip manufacturers in 2018 is as follows:
Among the seven major sectors of new infrastructure, 5G, artificial intelligence and big data centers are to achieve "digital industrialization", while new energy vehicles, intercity expressways, ultra-high voltage and industrial Internet of Things are to achieve "industrial digitalization". Both traditional industries and emerging digital industries are inseparable from basic elements such as power supply and semiconductors. Power semiconductors used for power transmission, conversion and management will undoubtedly be the most fundamental driving force for new infrastructure. The trend of new infrastructure and "domestic substitution" will create huge development space and opportunities for local power management chip manufacturers.
4. Wireless charging/fast charging market segments and major domestic manufacturers
近年來,以蘋果、華為、三星和OPPO等全球主流智慧終端廠商為代表的快速充電和無線充電技術備受消費者青睞。由於每部智慧型手機或筆記型電腦都標配至少一個電源適配器或充電器,龐大的終端應用數量預計將顯著提升市場對電源管理晶片的需求。
USB PD快充技術豐富的充電電壓和電流配置,使得各種電子設備能夠透過USB電纜滿足供電需求。它不僅可以為行動裝置供電,還可以直接為筆記型電腦和顯示器供電,實現雙向充電。鑑於USB介面在電子產品市場的高普及率,USB PD快充技術具有廣泛的應用前景。
此外,氮化鎵(GaN)裝置的應用也推動了快速充電技術的持續升級。 GaN電晶體的開關性能優於傳統的矽基MOSFET,能夠實現更高的開關頻率,進而在維持合理開關損耗的同時,可提升功率密度和瞬態性能。由於其更高的能量轉換效率,GaN快速充電具有更低的功耗和更少的發熱量,因此可以實現更小尺寸充電器產品的設計,有望成為快速充電技術升級的重要方向。
在無線充電和快充充電器市場,包括億衝無線、盈基鑫和中匯創智在內的多家本土晶片廠商已參與競爭。在氮化鎵快充充電器市場,珠海英諾賽克和蘇州良維半導體等晶片廠商也開始量產出貨。
5. Global power semiconductor market size and major manufacturers
功率積體電路(IC)、IGBT、MOSFET 和功率二極體是四種應用最廣泛的功率半導體產品。根據權威市場研究機構分析,2017 年全球功率半導體市場中,功率積體電路佔據 54% 的市場份額,是功率半導體產品中市場份額最大的。功率積體電路將電晶體、二極體、電阻器和電容器等元件整合到半導體晶片上,並具備所需的電路功能。根據應用的不同,功率積體電路包括 AC-DC 轉換、DC-DC 轉換、電源管理和驅動積體電路等。
IGBT accounts for 17%. Since IGBT has a wide operating frequency range and can cover a higher power range, it is widely used in railway transportation, photovoltaic power generation, automotive electronics and other fields; MOSFET accounts for 12% and is mainly used in uninterruptible power supplies, switching power supplies, inverters and other fields; power diodes account for 15% and is mainly used in power supplies, adapters, automobiles and consumer electronics.
According to IHS data, the global power semiconductor market size was approximately US$39.1 billion in 2018, and reached US$40.3 billion in 2019. The market size is expected to grow to US$44.1 billion in 2021, with a CAGR of 4.1% from 2018 to 2021. Among them, the Chinese market accounts for about 35%, with a market size of US$13.8 billion, a year-on-year increase of 9.5%, making it the largest single market for power semiconductors in the world.
The major manufacturers and market shares of the global power semiconductor market in 2019 are as follows:
目前,全球功率半導體市場主要由英飛凌、德州儀器、安森美半導體、義法半導體等海外廠商壟斷。我國本土廠商在許多細分市場自給率較低,因此,功率半導體的國產化勢在必行。
6. Domestic power semiconductor market size and major manufacturers
受全球新冠疫情影響,2020年全球功率半導體市場的成長趨勢難以預測。預計2020年將出現-9.1%的負成長,市場規模將達36.7億美元。預計2021年將成長8.1%,達到39.6億美元。
China's power semiconductor market was approximately US$14.48 billion in 2019, accounting for 35.9% of the global power semiconductor market. There will be negative growth in 2020, falling to $13.8 billion. Growth is expected to resume in 2021, with a growth rate exceeding 10%.
Although the Chinese market accounts for 1/3 of the global power semiconductor market, the proportion of local manufacturers is relatively low. Major international manufacturers such as Infineon, ST and Renesas still dominate the domestic market. But we can also see that traditional power semiconductor manufacturers such as Jilin Huawei, Yangzhou Yangjie and Suzhou Goodtech have shown strong competitiveness in the mid-to-low-end MOSFET, diode and thyristor markets. China Resources Micro, Silan Micro and BYD Semiconductor are also gradually gaining market positions in the IGBT field.
下表列出了一些國內功率半導體製造商及其主要產品。
The technology and applications of mid-to-low-end power semiconductor products represented by MOSFETs are relatively mature, and the industry threshold is not high, which is conducive to the rapid entry of local manufacturers. As major overseas manufacturers have successively withdrawn from the mid- to low-end power semiconductor market and specialized in high-profit products in fields such as automotive electronics and new energy, the global mid-to-low-end power semiconductor industry has gradually shifted to Taiwan and mainland China. With cost advantages and location advantages closer to the local market, local power semiconductor manufacturers are expected to take the lead in making breakthroughs at the mid- to low-end of the industry chain and continue to increase market share.
7: Wide bandgap semiconductor market and major domestic manufacturers
The research and application of wide-bandgap semiconductor materials represented by gallium nitride (GaN) and silicon carbide (SiC) have a history of more than 20 years, but it is only in recent years that their commercial development prospects have begun to emerge. The radio frequency front-end of 5G communications has strict requirements for high frequency and high efficiency, which is where gallium nitride (GaN) comes in. In addition, the demand for fast and efficient charging of automobile electrification and portable electronic products will also drive gallium nitride (GaN) power devices to the mass market, gradually replacing traditional silicon power devices.
Gallium nitride (GaN) devices can be divided into two categories: discrete devices and integrated devices. Separate devices mainly include enhancement mode (E-Mode) GaN transistors and depletion mode (D-Mode) GaN transistors. Representative manufacturers include Panasonic, EPC, Infineon, ON Semiconductor, GaN Systems and Transphorm. Integrated devices are divided into system-level packaging integration and system-level chip integration. Representative manufacturers include TI, EPC, Infineon, Navitas, Power Integrations (PI) and dialog.
氮化鎵裝置的主要分類及代表性廠商。 (圖片來源:Yole)
根據 Yole 對 GaN 應用市場的預測,GaN 將在 2019 年開始在功率應用領域快速成長,預計到 2022 年將超過 200 億美元,其中行動裝置的快速充電器是其主要驅動力。
The main application market growth and scale of GaN devices are among which non-automotive power applications are growing the fastest. (Source: Yole)
Although China's third-generation semiconductor research and manufacturing started late, a number of major gallium nitride and silicon carbide projects are under construction, including Xiamen Sanan Integrated's production lines covering GaAs, GaN, SiC chips and epitaxy; China Resources Microelectronics' 8-inch gallium nitride on silicon production line; Innosec's 8-inch gallium nitride on silicon production line in Suzhou; Hangzhou Silan Microelectronics' 12-inch advanced compound semiconductor production line in Xiamen. In addition to these IDM or foundry manufacturing lines with heavy capital investment, start-up companies such as Shenzhen Basic Semiconductor and Chengdu Nitrogen Silicon Technology have also begun to join the market. It is expected that more local manufacturers will be established and grow in the emerging wide bandgap semiconductor industry in the future.
8. Basic information of 30 domestic power management chip and power semiconductor manufacturers
The ASPENCORE analyst team selected the 30 most representative companies from many domestic power management and power device manufacturers and selected them according to the following categories:
-
Power management chip: 15 companies
-
Wireless charging/fast charging devices: 5 companies
-
功率半導體元件:5家公司
-
Wide bandgap semiconductor: 5 companies
國內30家電源管理晶片及功率半導體廠商資訊統計表:
資料來源:ASPENCORE
Among these 30 manufacturers, 12 are listed companies and two are start-ups that have been established for less than 5 years. Judging from the distribution of company headquarters locations, Shenzhen has the most with 9; Shanghai has 4; Beijing, Wuxi and Hangzhou each have 3; Suzhou and Zhuhai each have 2; Chengdu, Guangzhou, Yangzhou and Jilin each have 1.
9. 配件:30家國內電源管理晶片和功率半導體廠商綜合實力對比
盛邦股份
核心技術:低功耗類比訊號鍊與電源管理技術
主要產品:16大系列1,400餘種高效能類比IC產品,包括運算放大器、比較器、音訊/視訊放大器、類比數位類比轉換器、類比開關、電平轉換和介面晶片、小型邏輯晶片、LDO、微處理器電源監控晶片、DC/DC轉換器、背光和閃光LED驅動器、過壓裝置和負載開關、馬達保護和負載開關、電池驅動程式充電
主要應用領域:通訊設備、消費性電子產品、工業控制、物聯網智慧設備、穿戴式設備
主要客戶:模擬裝置用途廣泛,應用範圍廣,客戶眾多。
競爭優勢:完整的類比訊號鍊和電源管理產品線
矽立傑
核心技術:30W隔離式電荷泵快充技術,MiniLED驅動器
主要產品:電池管理晶片、DC-DC轉換器、過電流保護元件、LED驅動器、電源管理單元(PMU)。
主要應用領域:消費性電子產品、工業應用、電腦、通訊網路設備
主要客戶:智慧電視製造商、電腦和平板電腦製造商
競爭優勢:擁有超過1,200項與PMIC相關的專利
Xinpengwei
核心技術:高壓工業級電源管理技術
主要產品:AC-DC轉換器、DC-DC轉換器、充電管理、AC-DC工業電源晶片
主要應用領域:家用電器、標準電源、行動數位設備、工業驅動器
主要客戶:美的、格力、創維、飛利浦、中興、華為
競爭優勢:高低壓一體化技術平台
景豐明園
Main products: LED lighting driver chips, motor control chipsets
Core technology: intelligent lighting driver chip technology
主要應用:LED照明、馬達驅動
富曼電子
主要產品:電源管理、LED控制與驅動、MOSFET、MCU、非揮發性記憶體、RFID、射頻前端
核心技術:C型PD控制器,LED照明系統的溫度控制
主要應用領域:消費性電子、汽車電子
上海貝嶺
主要產品:智慧計量SoC、電源管理晶片、非揮發性記憶體、高速高精度ADC、工業控制半導體
核心技術:面向5G通訊的下一代智慧電錶測量與數據轉換技術
主要應用領域:電錶、行動電話、液晶電視和平面顯示器、機上盒
Angbao Electronics
Core technologies: Analog and digital-analog hybrid ICs using sub-micron CMOS, Bipolar, Bicmos, and BCD process technologies
Main products: AC/DC power management chips, lighting and backlight driver chips, MCU products
主要應用領域:通訊、消費性電子、電腦和介面設備
競爭優勢:領先的電腦和手機充電器用AC/DC電源管理晶片製造商,擁有300多項電源管理相關專利。
南芯半導體
核心技術:升降壓技術
主要產品:升降壓功率晶片、充電管理晶片、電荷泵晶片、無線充電器件
主要應用領域:手機充電器、消費性電子產品、行動電源、車用充電器
主要客戶:華為、小米及其他手機製造商
競爭優勢:在智慧終端外圍充電設備領域佔據主導地位
朱瓦特
核心技術:高能源效率電池管理系統
主要產品:DC-DC轉換器、電池管理系統、線性電源、LED照明驅動器
主要應用領域:消費性電子、工業應用、通訊與企業運算
微源半導體
核心技術:電源管理與電池充電
主要產品:電池充電晶片、電池管理系統晶片、過壓/過電流保護晶片、升壓/降壓裝置、LED驅動晶片
主要應用領域:電池系統、顯示系統、無線通訊系統及個人穿戴式裝置等。
深圳新智匯
核心技術:在功率計量、耗電量管理和音訊編解碼器等領域擁有獨特的領先技術
主要產品:電源管理單元、電池管理單元、音訊編解碼器、介面單晶片
主要應用領域:平板電腦、電視盒、行車記錄器、運動攝影機、無線儲存設備、智慧硬體、手持支付終端、電子書、微型投影機及其他產品
廣州金盛陽
Core technology: research and application of system integrated packaging (Chiplet SiP) platform technology, magnetic and electrical isolation technology and products
主要產品:CAN/485隔離收發器模組、AC/DC電源控制晶片、DC/DC電源控制晶片、介面晶片、啟動晶片、數位隔離器、接觸器節能控制晶片
主要應用領域:工業控制、電力、軌道運輸、汽車電子、物聯網、5G、醫療
Competitive advantages: More than 500 invention patents and independent research and development technology, Chiplet SiP packaging technology, providing one-stop power solutions
環球半導體/無錫博通微電子
核心技術:數位電源管理晶片
Main products: 120-180V compatible DCM-CCM-QR mode synchronous rectification, 85V process SSR chip
主要應用領域:5G智慧終端、消費通訊、工業控制、電視電源及白色家電、馬達電源應用、網路通訊產品、醫療設備電源
主要客戶:阿里巴巴、百度、小米、聯想、京東、中興、長虹、美菱、騰訊
Emerging projects: motor-motor power management, lithium battery charging pack management
競爭優勢:第三代數位電源管理晶片的創新者,一站式電源解決方案的晶片供應商
Xinzhou Technology
核心技術:功率轉換和功率控制
主要產品:高壓輸入降壓DCDC轉換器、高功率升壓DCDC轉換器、高功率功率元件閘極驅動器、無線充電發射器電源管理積體電路(PMIC)。
主要應用領域:工業控制、工業電源、電池管理系統 (BMS)、智慧工具、機器人、白色家電、汽車電子、通訊基地台、音訊系統、無線充電與傳輸
主要客戶:英威克、史東科技、合邁、美的、TCL空調、格力京宏、匯川、華陽、張瑞、國光、貝蘭、凌通
新興專案:汽車級直流-直流轉換器
China Resources Microelectronics
核心技術:專注於功率半導體和智慧感測器領域,為客戶提供一系列半導體產品和服務
Main products: MOSFET, IGBT, power IC, smart sensor, MCU, etc.
主要應用領域:功率元件主要集中於三大電氣應用:電池、電源和馬達;智慧感測器主要集中於物聯網和一般健康領域。
Main customers: In the home appliance category, there are large complete machine manufacturers such as Midea and Haier, which occupy the majority of the market share in low-speed electric vehicle motor controllers, as well as some manufacturers of small home appliances and mobile phone chargers.
競爭優勢:一家擁有涵蓋晶片設計、晶圓製造、封裝和測試等全產業鏈一體化營運能力的半導體公司。本公司擁有自主產品設計和可控製造工藝,在分立元件和積體電路領域具備強大的產品技術和製造工藝能力,並已形成先進的特色工藝和系列化產品線。
中匯創智
Core technologies: magnetic resonance wireless power supply technology, wireless power supply technology solutions for kitchen appliances
主要產品:各種功率無線電力供電IC和模組
Key applications: wireless charging of mobile phones, wireless power supply for robots, wireless power supply for power tools, wireless charging of electric energy vehicles
主要客戶:國家電網智慧、美的、新寶股份有限公司、牧源股份有限公司、億家河
Competitive advantage: the first company to commercialize wireless power supply for kitchen appliances
量子微半導體
核心技術:氮化鎵功率元件、氮化鎵積體電路、基於氮化鎵的先進功率解決方案
主要產品:氮化鎵功率元件
主要應用:USB-PD轉接器、智慧家庭、PC/伺服器電源、電動車車用電腦
主要客戶:比亞迪、美的、小米、飛利浦、亨特凱、TCL、海能等。
競爭優勢:最先進的氮化鎵功率元件技術與解決方案
美鑫盛
核心技術:高電壓、大電流、高功率類比電源管理與數位電路設計
Main products: wireless charging receiver chip, transmitter chip integrating USB-PD protocol, LED driver chip
主要應用領域:無線充電器、手機快充、TWS耳機充電盒及其他智慧終端設備
競爭優勢:專注於開發高度整合的電源管理晶片和系統,整合高性能類比電源、數位電源和軟體電源。
Easy to charge wireless
核心技術:即時充電,無需對準,全平面快速無線充電技術
主要產品:多模無線充電接收晶片EC4016和EC3016、多種無線充電發射器解決方案、無線充電系統最佳化工具和線圈設計工具
Key applications: Wireless charging applications for electronic devices such as mobile phones and tablets
Competitive advantages: It has more than 30 core US patents for wireless charging, and has many years of engineering research and development experience in the fields of wireless charging system architecture, power electronics technology, electromagnetic compatibility design, electromagnetic radiation protection and electromagnetic safety. Cooperated with Hong Kong wireless charging technology leader Convenient Power (CP) to establish Convenient Power Systems (CPS)
Yingji core
核心技術:電源管理、電池管理、無線訊號處理和高效能音訊訊號處理技術
Main products: power management, audio processing and battery management (including mobile power SoC)
Key applications: smartphones, tablets, set-top boxes, IPC, vehicle charging and other fields
新茂威
Core technology: sealed high-voltage synchronous rectification
Main products: AC-DC converters, high-voltage synchronous rectification devices, fast charging chips
主要應用領域:消費性電子、通訊、電腦、機器人、無人機、電力電子、醫療電子等。
金鑫威
Core technology: reverse wireless charging solution CV8035D, supporting up to 20W reception + 10W transmission.
Main products: wireless charging transmitter and receiver chips
主要應用領域:重點關注無線充電、穿戴式裝置、醫療保健和行動終端等新興領域。
比亞迪半導體
Core technology: design, manufacturing and testing of automotive grade IGBT and SiC devices
主要產品:功率半導體裝置、IGBT功率模組、電源管理IC、CMOS影像感測器、感測和控制IC、音訊和視訊處理IC等。
Key applications: new energy vehicles, industrial control
Main customer: BYD
Competitive advantage: The only supplier of automotive-grade IGBT devices in China, with advantages in integrating semiconductor devices and electric vehicle systems
揚傑科技
核心技術:SiC/IGBT/MOSFET/Clip封裝與晶圓設計及其他研發技術平台
主要產品:分離式元件晶片、整流元件、保護元件、小訊號元件、MOSFET、功率模組、碳化矽等。
主要應用領域:電源、家用電器、照明、安防、網路通訊、消費性電子、新能源、工業控制、汽車電子等領域
競爭優勢:垂直整合(IDM)半導體製造商
Suzhou Good Technetium
核心技術:專注於半導體整流器、功率二極體、整流橋和積體電路封裝測試
主要產品:橋式整流器、二極體、聚合物靜電抑制器、MOSFET、汽車整流器等。
主要應用領域:電源管理模組、消費性電子產品、汽車電子產品、工業設備、電腦設備、照明和通訊設備
Major customers: HW, Apple, BYD, Panasonic, Flextronics, Visteon, Hella, Omron
競爭優勢:完整的半導體分立元件產品線,MEMS-CMOS三維整合製造平台
Jilin Huawei
核心技術:功率半導體裝置設計、端子設計與製程控制技術
Main products: fully controlled power devices based on IGBT, MOSFET, and BJT (bipolar transistor); semi-controlled power devices based on Thyristor (thyristor); uncontrollable power diode devices based on Schottky diode and FRD (fast recovery diode); IPM (power module); TVS (transient suppression diode), Zener (Zener diode), TSS (semiconductor discharge tube) and other semiconductor protection devices
主要應用領域:新能源車、光電發電、變頻、工業控制、消費性電子等領域
競爭優勢:完整的功率半導體晶圓生產線
英諾賽克
Core technology: R&D and production of third-generation semiconductor power electronic devices
Main products: 30V-650V gallium nitride power and 5G RF devices
Key applications: new energy vehicles, 5G communications, data centers, wireless charging and fast charging
Emerging projects: 8-inch gallium nitride on silicon production line
競爭優勢:建成了中國首條8吋矽基氮化鎵外延晶片量產生產線
Shilanwei
Core technologies: The research and development of high-voltage BCD, ultra-thin trench gate IGBT, super-junction high-voltage MOSFET, high-density trench gate MOSFET, fast recovery diodes, MEMS sensors and other processes have formed a relatively complete characteristic process manufacturing platform;
Main products: power supply and power driver product line, MCU product line, digital audio and video product line, RF and mixed signal product line, discrete device product line, etc.;
主要應用領域:消費性電子、工業控制、汽車電子、家用電器;
主要客戶:華為、海康威視、美的、格力、海信、海爾、三星、索尼、台達、達科電子以及日本NEC等全球知名品牌客戶;
新興工程:年產能890億件的MEMS感測器擴建工程、特殊功率模組及功率元件封裝及測試生產線工程;
競爭優勢:半導體和積體電路產品的整合設計與製造 (IDM) 模式
basic semiconductors
Core technology: 650V~10kV silicon carbide process technology
主要產品:全電流電壓級碳化矽肖特基二極體、1200V碳化矽MOSFET、車規級全碳化矽功率模組等產品;150mm碳化矽外延片
主要應用領域:新能源、電動車、智慧電網、軌道運輸、工業控制、國防和軍事工業等。
競爭優勢:碳化矽功率元件的研發與產業化
氮矽技術
Core technology: Domestic production level 650V enhancement mode gallium nitride MOSFET
Main products: discrete high-speed gallium nitride gate driver chip (DX1SE-A), 650V enhancement mode gallium nitride MOSFET, gallium nitride power IC (DX2SE65A150)
Key applications: mobile phone fast charging, data center, on-board charging (OBC), LED power driver and 5G communication power supply, etc.
Note: This article is reproduced from the Internet. If there is any infringement, please contact us to delete it.
公司電話號碼:+86-0755-83044319
傳真:+86-0755-83975897
郵箱:1615456225@qq.com
QQ:3518641314 李經理
QQ:332496225 邱經理
地址:深圳市龍華新區民治大道1079號展濤科技大樓C座809室




粤公网安备44030002007346号